Microcapsule-type curable resin composition

{
  "publication_number": "US2025011526A1",
  "country": "US",
  "kind": "A1",
  "title": "Microcapsule-type curable resin composition",
  "abstract": "A microcapsule-type curable resin composition to be applied to a screwing member is capable of reducing the generation of crumbs when the screwing member is screwed into a base material, having excellent anti-loosening effect. A method for producing a screwing member, includes applying the microcapsule-type curable resin composition to a surface of a screwing member, and drying the composition to form a precoated adhesive layer. A screwing member has a precoated adhesive layer formed by applying the microcapsule-type curable resin composition to the surface of the screwing member and drying the composition. A microcapsule-type curable resin composition contains Component (A): an epoxy resin; Component (B): a water-dispersible binder; Component (C): a curing agent for an epoxy resin; and Component (D): a hollow filler.",
  "claims": [
    "1. A microcapsule-type curable resin composition comprising the following components (A) to (D): Component (A): an epoxy resin Component (B): a water-dispersible binder Component (C): a curing agent for an epoxy resin Component (D): a hollow filler. 2. The microcapsule-type curable resin composition according to claim 1, wherein the composition comprises at least one thiol compound as the component (C). 3. The microcapsule-type curable resin composition according to claim 1, wherein the component (A) and the component (C) are encapsulated in microcapsules different from each other. 4. The microcapsule-type curable resin composition according to claim 1, further comprising a curing accelerator as component (E). 5. The microcapsule-type curable resin composition according to claim 4, wherein the component (E) is a tertiary amine compound. 6. The microcapsule-type curable resin composition according to claim 1, wherein the component (D) is not treated with a silane coupling agent. 7. The microcapsule-type curable resin composition according to claim 1, wherein the component (B) is a polymer containing a (meth)acrylate as a constituent monomer. 8. The microcapsule-type curable resin composition according to claim 1, containing no dissolution medium other than water. 9. A method for producing a screwing member, comprising applying the microcapsule-type curable resin composition according to claim 1 to a surface of a screwed portion of a screwing member, and drying the composition to form an adhesive layer. 10. A screwing member produced by the production method according to claim 9."
  ],
  "description_excerpt": "The present invention relates to a microcapsule-type curable resin composition.\n\nConventionally, microcapsule-type adhesives for adhering screwing members such as screws, bolts, nuts, and small male screws are widely known. Examples thereof include a microcapsule-type adhesive for fixing screwing members containing a microcapsule formed by using an epoxy resin as a core material, a binder containing a polyvinyl butyral resin, and an imidazole curing agent having a long-chain alkyl group (refer to Japanese Patent Laid-Open No. 09-241351), a microcapsule-type adhesive for anti-loosening screws containing a microcapsule formed by using an epoxy resin as a core material and a reactive diluent, and an emulsion including a curing agent and a polyamide resin as a binder resin (refer to Japanese Patent Laid-Open No. 2003-194032), and a microcapsule-type adhesive for anti-loosening screws containing a microcapsule formed by using an organic peroxide as core material, a binder containing polyvinyl alcohol, and a (meth)acrylate monomer (refer to Japanese Patent Laid-Open No. 08-143822). Among these, an adhesive using an epoxy resin, in particular, is preferably used due to high anti-loosening effect resulting from high adhesion strength as resin properties.\n\nHowever, in the case where an adhesive using an epoxy resin is applied to a screwed portion of a screwing member such as a bolt and a nut, during screwing, a dried film of the adhesive tends to generate crumbs more easily due to rigid characteristics of the epoxy resin in comparison with an acrylate resin or the like.",
  "cpc": [
    "C08G 59/66",
    "C08G 59/686",
    "C08K 7/28",
    "C09J 163/00",
    "C09J 2203/326",
    "C09J 2301/412",
    "C09J 2463/00",
    "C09J 7/20",
    "C09J 9/00",
    "F16B 11/006",
    "F16B 39/021"
  ],
  "ipc": [
    "C08G 59/66",
    "C08K 7/28",
    "C09J 163/00",
    "C09J 7/20"
  ],
  "assignees": [
    "THREE BOND CO LTD"
  ],
  "inventors": [
    "SOGA TETSUNORI"
  ],
  "filing_date": "2022-10-18",
  "publication_date": "2025-01-09",
  "priority_date": "2021-11-17",
  "application_number": "US-202218708396-A",
  "family_id": "86396854"
}