Patent · US9708440B2 · B2 · US
High temperature three dimensional printing compositions
- (11) Publication number
- US9708440B2
- (21) Application number
- 14/756,942
- (22) Filing date
- 2015-10-30
- (30) Priority date
- 2015-06-18
- (43) Publication date
- 2017-07-18
- (45) Date of grant
- 2017-07-18
- (52) CPC
- C08G Macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds: 59/1477, 14/06, 59/4014, 63/91, 65/485, 73/128
- B29C Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing: 67/00
- B33Y Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering: 70/00, 80/00
- C08J Working-up; general processes of compounding; after-treatment not covered by subclasses C08B, C08C, C08F, C08G or C08H: 2361/14, 2361/34, 2463/10, 3/243
- C08K Use of inorganic or non-macromolecular organic substances as compounding ingredients: 5/1539
- C08L Compositions of macromolecular compounds: 61/14, 61/34, 63/00, 65/02, 79/08, 79/085, 85/02
- (73) Assignee
- NOVOSET LLC
- (54) Title
- High temperature three dimensional printing compositions
- (57) Abstract
A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.
- Full text
- View on Google Patents
Claims (6)
- A high performance and high temperature resin composition for three dimensional printing formed from a two stage cure, consisting of a first stage curable group (Component A), and a second stage curable group cured by thermal/heat cure (Component B); wherein Component A is selected from a photo-curable group, a peroxide curable group, a EB curable group, a cationic curable group, an IR curable group, an addition cure group, a condensation reactive group, and/or a chemical additive curable group; wherein Component B is selected from a cyanate ester, bismaleimide (BMI), benzoxazine, polyimide, phthalonitrile resin (PN), bismaleimide triazine (BT), silicone resin, epoxy, cyanate epoxy and mixtures thereof.
- The resin composition of claim 1, wherein said first stage and second stage cure is completed in a time period of less than 5 minutes.
- The resin composition of claim 1, wherein said high performance and high temperature resin composition has a Tg >300 C and is adapted for use with fibers for racing car body parts.
- The resin composition of claim 1, wherein said resin composition meets requirements of 14 CFR Part 25.853 for use in aircraft ducting, oil tank, water tank, waste tank and toilet parts.
- The resin composition of claim 1, wherein said resin composition is adapted for use for high temperature composite wheels.
- The resin composition of claim 1 comprising phthalonitrile resin (PN) or modified PN resin as component B and silica used in encapsulation application for power devices.
Citations (10)
- US2003083397A1
- US2008103226A1
- US2009061215A1
- US2014065378A1
- US2014239527A1
- US2015064299A1
- US6632893B2
- US8603612B2
- WO2012015604A1
- WO2014077848A1
Record as JSON
{
"publication_number": "US9708440B2",
"country": "US",
"kind": "B2",
"title": "High temperature three dimensional printing compositions",
"abstract": "A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.",
"claims": [
"1. A high performance and high temperature resin composition for three dimensional printing formed from a two stage cure, consisting of a first stage curable group (Component A), and a second stage curable group cured by thermal/heat cure (Component B); wherein Component A is selected from a photo-curable group, a peroxide curable group, a EB curable group, a cationic curable group, an IR curable group, an addition cure group, a condensation reactive group, and/or a chemical additive curable group; wherein Component B is selected from a cyanate ester, bismaleimide (BMI), benzoxazine, polyimide, phthalonitrile resin (PN), bismaleimide triazine (BT), silicone resin, epoxy, cyanate epoxy and mixtures thereof.",
"2. The resin composition of claim 1, wherein said first stage and second stage cure is completed in a time period of less than 5 minutes.",
"3. The resin composition of claim 1, wherein said high performance and high temperature resin composition has a Tg >300 C and is adapted for use with fibers for racing car body parts.",
"4. The resin composition of claim 1, wherein said resin composition meets requirements of 14 CFR Part 25.853 for use in aircraft ducting, oil tank, water tank, waste tank and toilet parts.",
"5. The resin composition of claim 1, wherein said resin composition is adapted for use for high temperature composite wheels.",
"6. The resin composition of claim 1 comprising phthalonitrile resin (PN) or modified PN resin as component B and silica used in encapsulation application for power devices."
],
"cpc": [
"C08G 59/1477",
"B29C 67/00",
"B33Y 70/00",
"B33Y 80/00",
"C08G 14/06",
"C08G 59/4014",
"C08G 63/91",
"C08G 65/485",
"C08G 73/128",
"C08J 2361/14",
"C08J 2361/34",
"C08J 2463/10",
"C08J 3/243",
"C08K 5/1539",
"C08L 61/14",
"C08L 61/34",
"C08L 63/00",
"C08L 65/02",
"C08L 79/08",
"C08L 79/085",
"C08L 85/02"
],
"assignees": [
"NOVOSET LLC"
],
"filing_date": "2015-10-30",
"publication_date": "2017-07-18",
"grant_date": "2017-07-18",
"priority_date": "2015-06-18",
"application_number": "US-201514756942-A",
"family_id": "57586888",
"citations": [
"US2003083397A1",
"US2008103226A1",
"US2009061215A1",
"US2014065378A1",
"US2014239527A1",
"US2015064299A1",
"US6632893B2",
"US8603612B2",
"WO2012015604A1",
"WO2014077848A1"
]
}
Record 1,637 of 5,000 in Patents full text (MLC-0201). Request the full dataset.