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Patent · US4412884A · A · US

Adhesive bonding method employing diene bis-imide polymers

(11) Publication number
US4412884A
(21) Application number
US-36574482-A
(22) Filing date
1982-04-05
(30) Priority date
1981-06-12
(43) Publication date
1983-11-01
(45) Date of grant
1983-11-01
(52) CPC
  • C08F Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds: 22/40
  • C08G Macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds: 73/121
(73) Assignee
UNITED TECHNOLOGIES CORP
(54) Title
Adhesive bonding method employing diene bis-imide polymers
(57) Abstract

A moisture resistant polyimide adhesive is disclosed comprising a polymer having repeating units of the formula: where n is equal to about 8 to about 20. The improved moisture resistance of the polymers according to the present invention is indicated by a moisture pick-up of less than about 0.6% by weight after 24 hour immersion in room temperature water. The polymer also exhibits a tensile strength greater than about 1800 psi (1.24x107 NT/M2). In addition to their improved adhesive and moisture resistant properties, the polymers according to the present invention exhibited such properties with cure times of less than about one hour at temperatures up to about 320 DEG C.

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Claims (3)

  1. A method of adhesion bonding two or more surfaces together comprising applying to at least one surface a moisture resistant polyimide adhesive formed by polymerizing monomers of the formula: ##STR6## to form a polymer with repeating units ##STR7## where n is about 8 to about 20, and the polymer has a room temperature water immersion moisture absorption rate less than about 0.6% by weight for 24 hours and a tensile lap shear strength greater than about 1800 psi (1.24×10 7 NT/M 2), such properties imparted to the polymer with curing for less than about one hour, followed by placing the two surfaces together with the adhesive in-between and curing for less than about one hour at about 250° C. to about 320° C.
  2. The method of claim 1 where n is about 8 to about 12.
  3. The method of claim 1 wherein n is about 12 to about 20.

Citations (14)

  • US2706720A
  • US3369055A
  • US3380964A
  • US3406148A
  • US3450711A
  • US3533996A
  • US3632428A
  • US3678073A
  • US3717615A
  • US3759779A
  • US3761430A
  • US3996203A
  • US4011386A
  • US4043986A
Record as JSON
{
  "publication_number": "US4412884A",
  "country": "US",
  "kind": "A",
  "title": "Adhesive bonding method employing diene bis-imide polymers",
  "abstract": "A moisture resistant polyimide adhesive is disclosed comprising a polymer having repeating units of the formula: where n is equal to about 8 to about 20. The improved moisture resistance of the polymers according to the present invention is indicated by a moisture pick-up of less than about 0.6% by weight after 24 hour immersion in room temperature water. The polymer also exhibits a tensile strength greater than about 1800 psi (1.24x107 NT/M2). In addition to their improved adhesive and moisture resistant properties, the polymers according to the present invention exhibited such properties with cure times of less than about one hour at temperatures up to about 320 DEG C.",
  "claims": [
    "1. A method of adhesion bonding two or more surfaces together comprising applying to at least one surface a moisture resistant polyimide adhesive formed by polymerizing monomers of the formula: ##STR6## to form a polymer with repeating units ##STR7## where n is about 8 to about 20, and the polymer has a room temperature water immersion moisture absorption rate less than about 0.6% by weight for 24 hours and a tensile lap shear strength greater than about 1800 psi (1.24×10 7 NT/M 2), such properties imparted to the polymer with curing for less than about one hour, followed by placing the two surfaces together with the adhesive in-between and curing for less than about one hour at about 250° C. to about 320° C.",
    "2. The method of claim 1 where n is about 8 to about 12.",
    "3. The method of claim 1 wherein n is about 12 to about 20."
  ],
  "cpc": [
    "C08F 22/40",
    "C08G 73/121"
  ],
  "assignees": [
    "UNITED TECHNOLOGIES CORP"
  ],
  "filing_date": "1982-04-05",
  "publication_date": "1983-11-01",
  "grant_date": "1983-11-01",
  "priority_date": "1981-06-12",
  "application_number": "US-36574482-A",
  "family_id": "26955964",
  "citations": [
    "US2706720A",
    "US3369055A",
    "US3380964A",
    "US3406148A",
    "US3450711A",
    "US3533996A",
    "US3632428A",
    "US3678073A",
    "US3717615A",
    "US3759779A",
    "US3761430A",
    "US3996203A",
    "US4011386A",
    "US4043986A"
  ]
}

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