Methods for containing liquid materials and maintaining part alignment during assembly operations

{
  "publication_number": "US8728269B2",
  "country": "US",
  "kind": "B2",
  "title": "Methods for containing liquid materials and maintaining part alignment during assembly operations",
  "abstract": "Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.",
  "claims": [
    "1. A method for assembling components, comprising: attaching a first component to a second component using a structure that includes a flexible substrate and adhesive; preventing movement of a liquid material using at least one edge of the structure; and solidifying the liquid material against the edge of the structure, wherein the first component comprises a camera module and the second component comprises a trim.",
    "2. The method defined in claim 1 wherein the liquid material comprises liquid adhesive and wherein solidifying the liquid material comprises curing the liquid adhesive.",
    "3. The method defined in claim 2 wherein curing the liquid adhesive comprises heating the liquid adhesive.",
    "4. The method defined in claim 2 wherein curing the liquid adhesive comprises applying ultraviolet light to the liquid adhesive.",
    "5. The method defined in claim 1 wherein the structure comprises a patterned piece of double-sided tape.",
    "6. The method defined in claim 1 wherein the liquid material comprises molten solder and wherein solidifying the liquid material comprises cooling the molten solder to form a solder joint between the first and second components.",
    "7. The method defined in claim 1 wherein the edge comprises an outer peripheral edge for the structure, wherein the liquid material surrounds the structure, and wherein preventing movement of the liquid material comprises preventing movement of the liquid material using the outer peripheral edge.",
    "8. The method defined in claim 1 wherein the edge comprises an inner peripheral edge for the structure, wherein the liquid material is surrounded by the structure, and wherein preventing movement of the liquid material comprises preventing movement of the liquid material using the inner peripheral edge.",
    "9. A method for assembling first and second components, comprising: attaching double-sided tape that has a substrate and adhesive to at least the first component, wherein the double-sided tape comprises an overflow structure; placing a liquid material between the first and second components; collecting excess amounts of the liquid material in the overflow structure while at least partly constraining movement of the liquid material using the double-sided tape; and solidifying the liquid material.",
    "10. The method defined in claim 9 wherein the liquid material comprises liquid adhesive and wherein solidifying the liquid material comprises curing the liquid adhesive.",
    "11. The method defined in claim 10 wherein curing the liquid adhesive comprises heating the liquid adhesive.",
    "12. The method defined in claim 10 wherein curing the liquid adhesive comprises applying ultraviolet light to the liquid adhesive.",
    "13. The method defined in claim 9, further comprising attaching the first component to the second component using the double-sided tape.",
    "14. The method defined in claim 9 wherein the double-sided tape forms a ring-shaped barrier and is configured to prevent the liquid material from flowing into the ring-shaped barrier.",
    "15. The method defined in claim 9 wherein the double-sided tape forms a ring-shaped barrier and is configured to prevent the liquid material from flowing out of the ring-shaped barrier.",
    "16. A method for assembling first and second components using liquid adhesive, comprising: placing the liquid adhesive between the first and second components; pressing the first and second components together; while the first and second components are being pressed together, laterally constraining movement of the liquid adhesive using a tape adhesive dam, wherein the tape adhesive dam forms a circular barrier; and curing the laterally constrained liquid adhesive to attach the first and second components together.",
    "17. The method defined in claim 16 wherein the tape adhesive dam forms a ring-shaped barrier and wherein laterally constraining movement of the liquid adhesive comprises preventing the liquid adhesive from flowing into the ring-shaped barrier.",
    "18. The method defined in claim 16 wherein the tape adhesive dam forms a ring-shaped barrier and wherein laterally constraining movement of the liquid adhesive comprises preventing the liquid adhesive from flowing out of the ring-shaped barrier.",
    "19. The method defined in claim 16 wherein curing the laterally constrained liquid adhesive comprises heating the laterally constrained liquid adhesive.",
    "20. The method defined in claim 16 wherein curing the laterally constrained liquid adhesive comprises applying ultraviolet light to the laterally constrained liquid adhesive."
  ],
  "description_excerpt": "This application is a division of patent application Ser. No. 12/753,005, filed Apr. 1, 2010, which is hereby incorporated by reference herein in its entirety. This application claims the benefit of and claims priority to patent application Ser. No. 12/753,005, filed Apr. 1, 2010.\n\nLiquid adhesive and solder are used in forming mechanical and electrical connections in a variety of contexts. For example, liquid adhesive may be used to attach parts together within an electronic device. Solder connections may be formed when it is desired to mount a component to a printed circuit board. It can be challenging to properly control liquid materials during manufacturing. Liquid materials such liquid adhesives and solder that are not well controlled may intrude into undesired portions of a workpiece. For example, a liquid material that is not properly controlled may wick into undesired areas between closely spaced parts. This excess material can then interfere with the desired operation of a product. Attempts to reduce undesired movement of intrusions of liquid materials by reducing the volume of liquid material that is used are sometimes counterproductive. Solder joints that are formed without using sufficient solder may be unreliable or may not exhibit satisfactory low-resistance electrical connections. Adhesive joints that are formed without using sufficient liquid adhesive may be weak.\n\nTo address these concerns, solder dam and glue dam structures have been developed.",
  "cpc": [
    "G02B 27/62",
    "B29C 65/1406",
    "B29C 65/4815",
    "B29C 65/4835",
    "B29C 65/4845",
    "B29C 65/7802",
    "B29C 66/124",
    "B29C 66/24221",
    "B29C 66/24244",
    "B29C 66/324",
    "B29C 66/3242",
    "B29C 66/53461",
    "B29C 66/9672",
    "B32B 37/12",
    "F16B 11/006",
    "Y10T 156/10",
    "Y10T 428/14",
    "Y10T 428/1405",
    "Y10T 428/218",
    "Y10T 428/24298",
    "Y10T 428/2848"
  ],
  "ipc": [
    "B32B 37/12"
  ],
  "assignees": [
    "APPLE INC"
  ],
  "inventors": [
    "HILL MATTHEW D",
    "WEBER TRENT"
  ],
  "filing_date": "2013-02-01",
  "publication_date": "2014-05-20",
  "grant_date": "2014-05-20",
  "priority_date": "2010-04-01",
  "application_number": "US-201313757065-A",
  "family_id": "44709992",
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}