MLchartDataset catalogue

Patent · US9242429B2 · B2 · US

Activated thread curing of liquid adhesives

(11) Publication number
US9242429B2
(21) Application number
13/911,029
(22) Filing date
2013-06-05
(30) Priority date
2013-03-14
(43) Publication date
2016-01-26
(45) Date of grant
2016-01-26
(51) IPC
B29C 65/00; B29C 65/34; B29C 65/48; B29C 65/50; B29C 65/52; B29C 65/78; B29L 31/34; B32B 3/10; B32B 37/12; B32B 5/24; B32B 7/04; B32B 7/06; B32B 7/12; C09J 5/00; F16B 11/00
(52) CPC
  • B32B Layered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form: 7/06, 2307/202, 2457/208, 3/10, 37/12, 5/24, 7/045, 7/05, 7/12
  • B29C Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing: 65/1406, 65/149, 65/342, 65/3468, 65/348, 65/3484, 65/4835, 65/4845, 65/488, 65/5035, 65/5057, 65/5092, 65/524, 65/76, 65/7826, 65/8253, 66/1122, 66/45, 66/8322
  • B29L Indexing scheme associated with subclass B29C, relating to particular articles: 2031/3475
  • C09J Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives: 5/00, 5/06
  • F16B Devices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges; joints or jointing: 11/006
  • Y10T Technical subjects covered by former us classification: 156/10, 156/1051, 428/24802, 428/24851
(73) Assignee
Apple Inc
(72) Inventors
Samuel T. Reineman; Kevin D. Gibbs; Amy Qian; Derek W. Wright
(54) Title
Activated thread curing of liquid adhesives
(57) Abstract

Structures and methods for providing a liquid adhesive between substrates of a composite structure are described. Methods include providing a liquid adhesive having a thread disposed therein between two substrates of a composite structure. In some embodiments, the thread has a fixed diameter which acts to provide a consistent gap between the two substrates. In some embodiments, the thread is configured to be activated during the assembly process to facilitate curing of the liquid adhesive. In some embodiments the thread is configured to be activated after the composite structure is formed to facilitate separation of the two substrates and disassembly of the composite structure. The thread can be made of a conductive or non-conductive material. In some embodiments, the thread is activated by passing a voltage through the thread to heat the thread. In some embodiments, the thread is activated by passing ultraviolet light through the thread.

Full text
View on Google Patents

Claims (28)

  1. A method of forming a composite structure having a first substrate and a second substrate, comprising: dispensing a liquid adhesive conglomerate onto a portion of a first substrate, wherein the liquid adhesive conglomerate comprises a fiber optic cable disposed within a liquid adhesive, the liquid adhesive curable by exposure to ultraviolet light; aligning the second substrate with respect to the first substrate; forming a gap between the first and second substrates by pressing the first and second surfaces together, the gap having a distance in accordance with a diameter of the fiber optic cable; and during the pressing, curing the liquid adhesive by passing ultraviolet light through the fiber optic cable so as to expose the liquid adhesive to ultraviolet light, wherein the gap remains in accordance with the diameter of the fiber optic cable after the liquid adhesive is cured.
  2. The method of claim 1, wherein the ultraviolet light scatters within the fiber optic cable so as to expose the liquid adhesive during a curing process.
  3. The method of claim 1, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure.
  4. The method of claim 1, wherein the fiber optic cable is configured to facilitate the disassembly of the composite structure after the liquid adhesive is cured.
  5. The method of claim 4, further comprising: subsequent to curing the liquid adhesive, disassembling the composite structure by pulling the fiber optic cable in a lateral direction with respect to the first and second substrates to cleave at least a portion of the cured liquid adhesive.
  6. The method of claim 5, wherein the fiber optic cable comprises cutting features that cut portions of the cured liquid adhesive to facilitate the disassembly of the composite structure.
  7. The method of claim 4, further comprising: reactivating the fiber optic cable by passing ultraviolet light through the fiber optic cable to soften or burn the cured liquid adhesive and destroy a bonding capability of the cured liquid adhesive to facilitate the disassembly of the composite structure.
  8. The method of claim 5, wherein the composite structure is part of a touch sensitive display assembly for an electronic device.
  9. The method of claim 4, wherein the fiber optic cable has a first and a second end which protrude from the composite structure, wherein the fiber optic cable is reactivated by passing ultraviolet light through the fiber optic cable via the first end or the second end of the fiber optic cable.
  10. The method of claim 1, further comprising: during the dispensing, bending the fiber optic cable into a predetermined shape onto the first substrate.
  11. The method of claim 1, wherein the liquid adhesive and fiber optic cable are dispensed simultaneously from a dispenser.
  12. A composite structure, comprising: a first substrate having a first surface; a second substrate having a second surface; a cured adhesive disposed between the first and second surfaces; and fiber optic cable disposed within the cured adhesive and between the first and second surfaces, wherein a gap between the first and second surfaces has a distance in accordance with a diameter of the fiber optic cable, wherein the cured adhesive was formed from a liquid adhesive that was cured by a curing process wherein ultraviolet light was passed through the fiber optic cable so as to cure at least a portion of the liquid adhesive.
  13. The composite structure of claim 12, wherein the composite structure is part of a touch sensitive display assembly for an electronic device.
  14. The composite structure of claim 12, wherein the cured adhesive is an optically clear adhesive.
  15. The composite structure of claim 12, wherein during the curing process, the ultraviolet light is scattered within the fiber optic cable so as to expose the liquid adhesive to the ultraviolet light.
  16. The composite structure of claim 12, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure.
  17. The composite structure of claim 12, wherein the fiber optic cable is configured to facilitate disassembly of the composite structure.
  18. The composite structure of claim 17, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure, the fiber optic cable configured to be pulled by the first or second end in a lateral direction with respect to the first and second surfaces to cleave at least a portion of the cured adhesive.
  19. The composite structure of claim 18, wherein the first or second end comprises a grasping feature to assist gripping and pulling of the first or second end.
  20. The composite structure of claim 18, wherein the fiber optic cable comprises cutting features that are configured to cut portions of the cured adhesive to facilitate the disassembly of the composite structure.
  21. The composite structure of claim 20, wherein the cutting features are comprised of abrasive particles embedded on exterior surfaces of the fiber optic cable.
  22. The composite structure of claim 17, wherein the fiber optic cable is configured to be reactivated by passing ultraviolet light through the fiber optic cable.
  23. The composite structure of claim 22, wherein the ultraviolet light from the reactivated fiber optic cable softens or burns the cured adhesive to destroy bonding capability of the cured adhesive.
  24. A method of forming a composite structure having a first substrate and a second substrate, comprising: dispensing a fiber optic cable disposed within a liquid adhesive onto a portion of a first surface of the first substrate, the liquid adhesive curable by exposure to ultraviolet light; aligning a second surface of the second substrate with respect to the portion of the first surface; pressing the first and second surfaces together such that a gap is formed between the first and second surfaces, the gap having a distance in accordance with a diameter of the fiber optic cable; during the pressing, curing the liquid adhesive by passing ultraviolet light through the fiber optic cable so as to expose the liquid adhesive to ultraviolet light, wherein the gap between the first and second surfaces has a distance that remains in accordance with the diameter of the fiber optic cable after the liquid adhesive is cured; determining if rework of the composite structure is required; and when it is determined that rework is required, reactivating the fiber optic cable by passing ultraviolet light though the fiber optic cable after the liquid adhesive is cured.
  25. The method of claim 24, further comprising: subsequent to reactivating the fiber optic cable, disassembling the composite structure by pulling the fiber optic cable in a lateral direction with respect to the first and second surfaces to cleave at least a portion of the cured liquid adhesive.
  26. The method of claim 25, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure, wherein pulling the fiber optic cable comprises grasping the first end and/or the second end to facilitate pulling of the fiber optic cable.
  27. The method of claim 26, wherein the first end and/or the second end comprises a grasping feature to assist gripping and pulling of the first end and/or the second end.
  28. The method of claim 24, further comprising: during the dispensing, bending the fiber optic cable into a predetermined shape onto the first surface of the first substrate.

Description

The described embodiments relate generally to liquid adhesives used to bond substrates. More particularly, methods for providing a consistent gap between substrates bonded together using liquid adhesives and for curing liquid adhesives between substrates are described.

Liquid adhesives, such as liquid optically clear adhesives (LOCAs), are used in a wide variety of electronic assemblies. For example, liquid adhesive can be used to bond a touch panel to a main liquid crystal display. Liquid adhesive can also be used to bond a protective cover, such as a cover glass or lens, to a touch panel. The use of liquid adhesives to bond substrates in display assemblies, in particular, has a number of advantages. For example, liquid adhesive can improve the durability of a display assembly. In addition, use of liquid adhesive make the display assembly more easy to rework compared to assemblies bonded using adhesive tape.

Since liquid adhesives are in liquid form, they can require special care when applying them to substrates. In particular, care should be taken to ensure that the introduction of bubbles or voids between the substrates is avoided. In addition, care should be taken to avoid inconsistent curing of the liquid adhesive in different locations of the substrates so as to prevent distortions, visible defects in the final product. In addition, pressure applied to the substrates during a curing process should be consistent in order to provide a consistent gap between the substrates. If multiple substrates are bond together in a stack, any inconsistencies in the gaps between the substrates can be exacerbated.

Citations (7)

  • US5243162A
  • WO2001019937A1
  • US20110307723A1
  • US20020134543A1
  • US8071874B2
  • DE10245564A1
  • US7901532B2
Record as JSON
{
  "publication_number": "US9242429B2",
  "country": "US",
  "kind": "B2",
  "title": "Activated thread curing of liquid adhesives",
  "abstract": "Structures and methods for providing a liquid adhesive between substrates of a composite structure are described. Methods include providing a liquid adhesive having a thread disposed therein between two substrates of a composite structure. In some embodiments, the thread has a fixed diameter which acts to provide a consistent gap between the two substrates. In some embodiments, the thread is configured to be activated during the assembly process to facilitate curing of the liquid adhesive. In some embodiments the thread is configured to be activated after the composite structure is formed to facilitate separation of the two substrates and disassembly of the composite structure. The thread can be made of a conductive or non-conductive material. In some embodiments, the thread is activated by passing a voltage through the thread to heat the thread. In some embodiments, the thread is activated by passing ultraviolet light through the thread.",
  "claims": [
    "1. A method of forming a composite structure having a first substrate and a second substrate, comprising: dispensing a liquid adhesive conglomerate onto a portion of a first substrate, wherein the liquid adhesive conglomerate comprises a fiber optic cable disposed within a liquid adhesive, the liquid adhesive curable by exposure to ultraviolet light; aligning the second substrate with respect to the first substrate; forming a gap between the first and second substrates by pressing the first and second surfaces together, the gap having a distance in accordance with a diameter of the fiber optic cable; and during the pressing, curing the liquid adhesive by passing ultraviolet light through the fiber optic cable so as to expose the liquid adhesive to ultraviolet light, wherein the gap remains in accordance with the diameter of the fiber optic cable after the liquid adhesive is cured.",
    "2. The method of claim 1, wherein the ultraviolet light scatters within the fiber optic cable so as to expose the liquid adhesive during a curing process.",
    "3. The method of claim 1, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure.",
    "4. The method of claim 1, wherein the fiber optic cable is configured to facilitate the disassembly of the composite structure after the liquid adhesive is cured.",
    "5. The method of claim 4, further comprising: subsequent to curing the liquid adhesive, disassembling the composite structure by pulling the fiber optic cable in a lateral direction with respect to the first and second substrates to cleave at least a portion of the cured liquid adhesive.",
    "6. The method of claim 5, wherein the fiber optic cable comprises cutting features that cut portions of the cured liquid adhesive to facilitate the disassembly of the composite structure.",
    "7. The method of claim 4, further comprising: reactivating the fiber optic cable by passing ultraviolet light through the fiber optic cable to soften or burn the cured liquid adhesive and destroy a bonding capability of the cured liquid adhesive to facilitate the disassembly of the composite structure.",
    "8. The method of claim 5, wherein the composite structure is part of a touch sensitive display assembly for an electronic device.",
    "9. The method of claim 4, wherein the fiber optic cable has a first and a second end which protrude from the composite structure, wherein the fiber optic cable is reactivated by passing ultraviolet light through the fiber optic cable via the first end or the second end of the fiber optic cable.",
    "10. The method of claim 1, further comprising: during the dispensing, bending the fiber optic cable into a predetermined shape onto the first substrate.",
    "11. The method of claim 1, wherein the liquid adhesive and fiber optic cable are dispensed simultaneously from a dispenser.",
    "12. A composite structure, comprising: a first substrate having a first surface; a second substrate having a second surface; a cured adhesive disposed between the first and second surfaces; and fiber optic cable disposed within the cured adhesive and between the first and second surfaces, wherein a gap between the first and second surfaces has a distance in accordance with a diameter of the fiber optic cable, wherein the cured adhesive was formed from a liquid adhesive that was cured by a curing process wherein ultraviolet light was passed through the fiber optic cable so as to cure at least a portion of the liquid adhesive.",
    "13. The composite structure of claim 12, wherein the composite structure is part of a touch sensitive display assembly for an electronic device.",
    "14. The composite structure of claim 12, wherein the cured adhesive is an optically clear adhesive.",
    "15. The composite structure of claim 12, wherein during the curing process, the ultraviolet light is scattered within the fiber optic cable so as to expose the liquid adhesive to the ultraviolet light.",
    "16. The composite structure of claim 12, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure.",
    "17. The composite structure of claim 12, wherein the fiber optic cable is configured to facilitate disassembly of the composite structure.",
    "18. The composite structure of claim 17, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure, the fiber optic cable configured to be pulled by the first or second end in a lateral direction with respect to the first and second surfaces to cleave at least a portion of the cured adhesive.",
    "19. The composite structure of claim 18, wherein the first or second end comprises a grasping feature to assist gripping and pulling of the first or second end.",
    "20. The composite structure of claim 18, wherein the fiber optic cable comprises cutting features that are configured to cut portions of the cured adhesive to facilitate the disassembly of the composite structure.",
    "21. The composite structure of claim 20, wherein the cutting features are comprised of abrasive particles embedded on exterior surfaces of the fiber optic cable.",
    "22. The composite structure of claim 17, wherein the fiber optic cable is configured to be reactivated by passing ultraviolet light through the fiber optic cable.",
    "23. The composite structure of claim 22, wherein the ultraviolet light from the reactivated fiber optic cable softens or burns the cured adhesive to destroy bonding capability of the cured adhesive.",
    "24. A method of forming a composite structure having a first substrate and a second substrate, comprising: dispensing a fiber optic cable disposed within a liquid adhesive onto a portion of a first surface of the first substrate, the liquid adhesive curable by exposure to ultraviolet light; aligning a second surface of the second substrate with respect to the portion of the first surface; pressing the first and second surfaces together such that a gap is formed between the first and second surfaces, the gap having a distance in accordance with a diameter of the fiber optic cable; during the pressing, curing the liquid adhesive by passing ultraviolet light through the fiber optic cable so as to expose the liquid adhesive to ultraviolet light, wherein the gap between the first and second surfaces has a distance that remains in accordance with the diameter of the fiber optic cable after the liquid adhesive is cured; determining if rework of the composite structure is required; and when it is determined that rework is required, reactivating the fiber optic cable by passing ultraviolet light though the fiber optic cable after the liquid adhesive is cured.",
    "25. The method of claim 24, further comprising: subsequent to reactivating the fiber optic cable, disassembling the composite structure by pulling the fiber optic cable in a lateral direction with respect to the first and second surfaces to cleave at least a portion of the cured liquid adhesive.",
    "26. The method of claim 25, wherein the fiber optic cable has a first end and a second end which protrude from the composite structure, wherein pulling the fiber optic cable comprises grasping the first end and/or the second end to facilitate pulling of the fiber optic cable.",
    "27. The method of claim 26, wherein the first end and/or the second end comprises a grasping feature to assist gripping and pulling of the first end and/or the second end.",
    "28. The method of claim 24, further comprising: during the dispensing, bending the fiber optic cable into a predetermined shape onto the first surface of the first substrate."
  ],
  "description_excerpt": "The described embodiments relate generally to liquid adhesives used to bond substrates. More particularly, methods for providing a consistent gap between substrates bonded together using liquid adhesives and for curing liquid adhesives between substrates are described.\n\nLiquid adhesives, such as liquid optically clear adhesives (LOCAs), are used in a wide variety of electronic assemblies. For example, liquid adhesive can be used to bond a touch panel to a main liquid crystal display. Liquid adhesive can also be used to bond a protective cover, such as a cover glass or lens, to a touch panel. The use of liquid adhesives to bond substrates in display assemblies, in particular, has a number of advantages. For example, liquid adhesive can improve the durability of a display assembly. In addition, use of liquid adhesive make the display assembly more easy to rework compared to assemblies bonded using adhesive tape.\n\nSince liquid adhesives are in liquid form, they can require special care when applying them to substrates. In particular, care should be taken to ensure that the introduction of bubbles or voids between the substrates is avoided. In addition, care should be taken to avoid inconsistent curing of the liquid adhesive in different locations of the substrates so as to prevent distortions, visible defects in the final product. In addition, pressure applied to the substrates during a curing process should be consistent in order to provide a consistent gap between the substrates. If multiple substrates are bond together in a stack, any inconsistencies in the gaps between the substrates can be exacerbated.",
  "cpc": [
    "B32B 7/06",
    "B29C 65/1406",
    "B29C 65/149",
    "B29C 65/342",
    "B29C 65/3468",
    "B29C 65/348",
    "B29C 65/3484",
    "B29C 65/4835",
    "B29C 65/4845",
    "B29C 65/488",
    "B29C 65/5035",
    "B29C 65/5057",
    "B29C 65/5092",
    "B29C 65/524",
    "B29C 65/76",
    "B29C 65/7826",
    "B29C 65/8253",
    "B29C 66/1122",
    "B29C 66/45",
    "B29C 66/8322",
    "B29L 2031/3475",
    "B32B 2307/202",
    "B32B 2457/208",
    "B32B 3/10",
    "B32B 37/12",
    "B32B 5/24",
    "B32B 7/045",
    "B32B 7/05",
    "B32B 7/12",
    "C09J 5/00",
    "C09J 5/06",
    "F16B 11/006",
    "Y10T 156/10",
    "Y10T 156/1051",
    "Y10T 428/24802",
    "Y10T 428/24851"
  ],
  "ipc": [
    "B29C 65/00",
    "B29C 65/34",
    "B29C 65/48",
    "B29C 65/50",
    "B29C 65/52",
    "B29C 65/78",
    "B29L 31/34",
    "B32B 3/10",
    "B32B 37/12",
    "B32B 5/24",
    "B32B 7/04",
    "B32B 7/06",
    "B32B 7/12",
    "C09J 5/00",
    "F16B 11/00"
  ],
  "assignees": [
    "Apple Inc"
  ],
  "inventors": [
    "Samuel T. Reineman",
    "Kevin D. Gibbs",
    "Amy Qian",
    "Derek W. Wright"
  ],
  "filing_date": "2013-06-05",
  "publication_date": "2016-01-26",
  "grant_date": "2016-01-26",
  "priority_date": "2013-03-14",
  "application_number": "US-201313911029-A",
  "family_id": "51528346",
  "cited_by_count": 0,
  "citations": [
    "US5243162A",
    "WO2001019937A1",
    "US20110307723A1",
    "US20020134543A1",
    "US8071874B2",
    "DE10245564A1",
    "US7901532B2"
  ]
}

Record 4,907 of 8,000 in Patents full text (MLC-0201). Request the full dataset.