Resin composition for EMI shielding, comprising carbon hydride composite

{
  "publication_number": "US9505903B2",
  "country": "US",
  "kind": "B2",
  "title": "Resin composition for EMI shielding, comprising carbon hydride composite",
  "abstract": "Provided is a resin composition for electromagnetic interference shielding. More particularly, provided is a resin composition having superior dispersibility and impact relaxation and high conductivity, the resin comprising: (a) 100 parts by weight of a resin; based on 100 parts by weight of the resin, (b) 0.1 to 15 parts by weight of a carbon nanotube surface-modified in a condition of the absence of oxidant; and (c) 1 to 40 parts by weight of a carbon compound, a metal, a metal compound, or a mixture thereof. The resin composition for electromagnetic interference shielding, comprising a carbon hydride composite, is specifically useful in an electronic control unit material for weight reduction of car, and thus can be replaced with a high-priced heavy metal material.",
  "claims": [
    "1. A resin composition for electromagnetic interference (EMI) shielding, the resin composition comprising: (a) 100 parts by weight of a resin; based on 100 parts by weight of the resin, (b) 0.1 to 15 parts by weight of a carbon nanotube surface-modified in a condition of the absence of oxidant; and (c) 1 to 40 parts by weight of a carbon compound, metal, metal compound, or mixture thereof, wherein the carbon nanotube surface-modified in a condition of the absence of oxidant is obtained by surface-treating a conductive additive consisting of a carbon nanotube in a subcritical water or a supercritical water condition of a pressure of 50 to 400 atm and a temperature of 100 to 600° C., and at least the carbon compound is not surface-modified in a condition in the absence of oxidant.",
    "2. The resin composition of claim 1, wherein the resin is one resin, a copolymer resin of two or more, or a mixture of two or more, selected from the group consisting of a polyacetal resin, an acryl based resin, a polycarbonate resin, a styrene based resin, a polyester resin, a vinyl based resin, a polyphenylene ether resin, a polyolefin resin, an acrylonitrile-butadiene-styrene copolymer resin, a polyarylate resin, a polyamide resin, a polyamideimide resin, a polyarylsulfone resin, a polyetherimide resin, a polyethersulfone resin, a polyphenylene sulfide resin, a fluorine based resin, a polyimide resin, a polyether ketone resin, a polybenzoxazole resin, a polyoxadiazol resin, a polybenzothiazole resin, a polybenzimidazole resin, a polypyridine resin, a polytriazole resin, a polypyrrolidone resin, a polydibenzofuran resin, a polysulfone resin, a polyurea resin, a polyphosphazene resin, a liquid crystal polymer resin, a silicon based resin, an epoxy resin, a phenol based resin, and a polyurethane resin.",
    "3. The resin composition of claim 1, wherein the carbon nanotube is selected from the group consisting of a single-walled carbon nanotube, a double-walled carbon nanotube, a thin multi-walled carbon nanotube, a multi-walled carbon nanotube, a roped carbon nanotube, and a combination thereof.",
    "4. The resin composition of claim 1, wherein the carbon compound is selected from the group consisting of carbon black, graphene, fullerene, graphite, graphite oxide, carbon fiber, and a mixture thereof.",
    "5. The resin composition of claim 1, wherein the metal or metal compound is selected from the group consisting of copper, iron, nickel, aluminum, tin, zinc, silver, gold, nickel-copper alloy, alumina (Al 2 O 3), alumina nitride (AlN), and oxides thereof.",
    "6. The resin composition of claim 1, wherein the carbon compound, metal, or metal compound has an average particle size of 0.001˜300 μm.",
    "7. The resin composition of claim 1, wherein a weight ratio of the (b) carbon nanotube surface-modified in a condition of the absence of oxidant to the (c) carbon compound, metal, metal compound, or mixture thereof is 1:0.01 to 1:100.",
    "8. A molded article manufactured by extruding, ejecting, or heat-molding the resin composition for EMI shielding of claim 1.",
    "9. The molded article of claim 8, wherein the molded article is a plastic molded article capable of allowing thermal conductivity, electrostatic dispersion, or prevention of static electricity, by controlling an EMI shielding effect."
  ],
  "description_excerpt": "The following disclosure relates to a resin composition for electromagnetic interference (EMI) shielding, comprising a carbon hydride composite. More particularly, the following disclosure relates to a high-conductive resin composition for EMI shielding, having excellent dispersibility and impact relaxation, and containing: (a) 100 parts by weight of a resin; based on 100 parts by weight of the resin, (b) 0.1 to 15 parts by weight of carbon nanotubes surface-modified in the subcritical water or supercritical water condition not using a separate oxidant (hereinafter, a condition of the absence of oxidant); and (c) 1 to 40 parts by weight of a carbon compound, metal, a metal compound, or a mixture thereof. The resin composition for EMI shielding, comprising a carbon hydride composite, according to the present invention, is specifically useful in an electronic control unit material for weight reduction of a car, and thus can be replaced with a high-priced heavy metal material.\n\nMiniaturization and integration of electronic devices have caused the flood of electromagnetic waves even at work and home together with rapid supply of PC, mobile phones, and digital devices, and thus electronic industries have been developed but the threat of electromagnetic interference has been more growing.\n\nThe electromagnetic interference variously appears ranging from false operations of computers to burnout accidents of factories, and further, research results about adverse effects of the electromagnetic interference on human bodies are represented one after another, so that concerns and interests for health have increased.",
  "cpc": [
    "C08K 3/22",
    "C08J 2300/22",
    "C08J 2323/12",
    "C08J 5/005",
    "C08K 2003/045",
    "C08K 3/013",
    "C08K 3/04",
    "C08K 3/041",
    "C08K 3/08",
    "C08K 3/10",
    "C08K 9/00",
    "C08L 101/12",
    "H05K 9/00",
    "H05K 9/0083",
    "H05K 9/009",
    "Y10S 977/752"
  ],
  "ipc": [
    "C08K 3/04",
    "C08K 3/22",
    "C08J 5/00",
    "G21F 1/10",
    "G21K 1/10",
    "H05K 9/00"
  ],
  "assignees": [
    "Hanwha Chemical Corp"
  ],
  "inventors": [
    "Jin Seo Lee",
    "Man Woo Jung",
    "Seung Hoe Do",
    "Seong Yun Jeon",
    "Jae Yun Lim"
  ],
  "filing_date": "2013-01-04",
  "publication_date": "2016-11-29",
  "grant_date": "2016-11-29",
  "priority_date": "2012-01-12",
  "application_number": "US-201314371807-A",
  "family_id": "48781667",
  "cited_by_count": 9,
  "citations": [
    "JP2003505332A",
    "JP2002097375A",
    "US20060116443A1",
    "KR20060039277A",
    "US7861559B2",
    "US20100080978A1",
    "JP2010513653A",
    "KR100873870B1",
    "JP2010027512A",
    "US20100056819A1",
    "WO2010059008A2",
    "KR20100058342A",
    "TW201035996A",
    "KR20100086854A",
    "WO2011002222A2",
    "TW201105576A",
    "KR101021805B1"
  ]
}