Patent · US9733486B2 · B2 · US
Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing
- (11) Publication number
- US9733486B2
- (21) Application number
- 14/814,297
- (22) Filing date
- 2015-07-30
- (30) Priority date
- 2013-03-13
- (43) Publication date
- 2017-08-15
- (45) Date of grant
- 2017-08-15
- (51) IPC
- G02B 27/58; G02B 3/00; G02B 5/00; H04N 23/16; H04N 23/95; H04N 25/00; H04N 25/78; H01L 27/146
- (52) CPC
- G02B Optical elements, systems or apparatus: 27/58, 3/0056, 5/003
- H01L Semiconductor devices; electric solid state devices not otherwise provided for: 27/14621, 27/14623, 27/14627
- H04N Pictorial communication, e.g. television: 23/45, 23/843, 23/95, 25/134, 25/70, 25/78, 5/225, 5/2254, 5/2258, 5/378, 9/045
- H10F Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation: 39/8053, 39/8057, 39/8063
- (73) Assignee
- Fotonation Cayman Ltd
- (72) Inventors
- Dan Lelescu; Kartik Venkataraman
- (54) Title
- Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing
- (57) Abstract
Imager arrays, array camera modules, and array cameras in accordance with embodiments of the invention utilize pixel apertures to control the amount of aliasing present in captured images of a scene. One embodiment includes a plurality of focal planes, control circuitry configured to control the capture of image information by the pixels within the focal planes, and sampling circuitry configured to convert pixel outputs into digital pixel data. In addition, the pixels in the plurality of focal planes include a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information, and the pixel stack defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area.
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Claims (19)
- An imager array, comprising: a plurality of focal planes, where each of the plurality of focal planes comprises a two dimensional arrangement of pixels having at least two pixels in each dimension having a pixel pitch and each of the plurality of focal planes is contained within a region of the imager array that does not contain pixels from another one of the plurality of focal planes; control circuitry configured to control the capture of image information by the at least two pixels in each dimension within each of the plurality of focal planes; and sampling circuitry configured to convert pixel outputs into digital pixel data; wherein the pixels in the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information; wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area and pixel stacks of each of the at least two pixels in each dimension of each of the plurality of focal planes are arranged to have a ratio of active area to pixel pitch that causes at least a certain amount of desired aliasing in the image information captured by the sampling circuitry.
- The imager array of claim 1, wherein the pixel aperture of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes is formed by a microlens that is smaller than the pixel area.
- The imager array of claim 2, wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in the at least two pixels in each dimension of each of the plurality of focal planes.
- The imager array of claim 3, wherein light is prevented from entering the pixel stacks through the gaps between the adjacent microlenses by a light blocking material.
- The imager array of claim 4, wherein photoresist is located in the gaps between the adjacent microlenses.
- The imager array of claim 2, wherein the amount of aliasing in the image information captured by one of the plurality of focal planes is greater than the amount of aliasing that would be present were the microlens to occupy the entire pixel area defined by the pixel stack.
- The imager array of claim 2, wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes further comprises an oxide layer and the microlens sits atop the oxide layer.
- The imager array of claim 7, wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes includes a color filter.
- The imager array of claim 8, wherein the color filter in the pixel stack of each pixel in the at least two pixels in each dimension of a one of the plurality of focal planes is the same.
- The imager array of claim 8, wherein the color filters in the pixel stacks of the pixels in the at least two pixels in each dimension of a one of the plurality of focal planes form a Bayer filter pattern.
- The imager array of claim 7, wherein the pixel stack of each pixel in the at least two pixels in each dimension of a one of the plurality of focal planes does not include a color filter.
- The imager array of claim 7, wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes includes a nitride passivation layer and a bottom oxide layer that provides support and isolation for metal interconnects.
- The imager array of claim 1, wherein the pixel aperture of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes is formed using at least one light blocking material.
- An array camera module, comprising: an imager array configured to capture light field image data, comprising: a plurality of focal planes, where each of the plurality of focal planes comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each of the plurality of focal planes is contained within a region of the imager array that does not contain pixels from another one of the plurality of focal planes; control circuitry configured to control the capture of image information from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes; and sampling circuitry configured to convert pixel outputs from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes into digital pixel data; wherein each pixel from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information; wherein the pixel stack in each pixel defines a pixel area and includes a pixel aperture, where the size of the pixel aperture is smaller than the pixel area; an optic array of lens stacks, where each of the lens stacks in the optical array form an image including aliasing on a particular one of the plurality of focal planes; and wherein pixel stacks of each of the at least two pixels in each dimension of each of the plurality of focal planes are arranged to have a ratio of active area to pixel pitch that causes at least a certain amount of desired aliasing in the image information captured by the sampling circuitry.
- The array camera module of claim 14, wherein the pixel aperture is formed by a microlens that is smaller than the pixel area.
- The array camera module of claim 15, wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in a particular one of the plurality of focal planes.
- The array camera module of claim 16, wherein light is prevented from entering the pixel stacks of the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes through the gaps between the microlenses by a light blocking material.
- The array camera module of claim 17, wherein photoresist is located in the gaps between the microlenses.
- The array camera module of claim 15, wherein the amount of aliasing in images captured by a one of the plurality of focal planes is greater than the amount of aliasing that would be present were the microlens of the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes to occupy the entire pixel area defined by the pixel stack.
Description
The present invention relates to super-resolution processing and more specifically to controlling aliasing in an array camera during super-resolution processing.
In a typical imaging device, light enters through an opening (aperture) at one end of the imaging device and is directed to an image sensor by one or more optical elements such as lenses. The image sensor includes pixels that generate signals upon receiving light via the optical element. Commonly used image sensors include charge-coupled device image sensors (CCDs) and complementary metal-oxide semiconductor (CMOS) sensors.
Conventional digital cameras typically achieve color separation by performing color separation in the optical path and using a separate image sensor for the wavelengths of light corresponding to each of the primary colors (i.e. RGB), using an image sensor with color separation and multiple signal collection capability within each pixel, or by applying filters over a single sensor so that individual pixels detect wavelengths of light corresponding to one of the primary colors. Use of filters is particularly common in cameras that have a small form factor, such as cameras incorporated in mobile phone handsets and other consumer electronics devices including but not limited to, laptop computers and televisions. A common filter that is formed on image sensors is the Bayer filter, the pattern of which includes 50% green filters, 25% red filters, and 25% blue filters. The output of an image sensor to which a Bayer filter is applied can be reconstructed as a color image using interpolation techniques.
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{
"publication_number": "US9733486B2",
"country": "US",
"kind": "B2",
"title": "Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing",
"abstract": "Imager arrays, array camera modules, and array cameras in accordance with embodiments of the invention utilize pixel apertures to control the amount of aliasing present in captured images of a scene. One embodiment includes a plurality of focal planes, control circuitry configured to control the capture of image information by the pixels within the focal planes, and sampling circuitry configured to convert pixel outputs into digital pixel data. In addition, the pixels in the plurality of focal planes include a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information, and the pixel stack defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area.",
"claims": [
"1. An imager array, comprising: a plurality of focal planes, where each of the plurality of focal planes comprises a two dimensional arrangement of pixels having at least two pixels in each dimension having a pixel pitch and each of the plurality of focal planes is contained within a region of the imager array that does not contain pixels from another one of the plurality of focal planes; control circuitry configured to control the capture of image information by the at least two pixels in each dimension within each of the plurality of focal planes; and sampling circuitry configured to convert pixel outputs into digital pixel data; wherein the pixels in the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information; wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes defines a pixel area and includes a pixel aperture, where the size of the pixel apertures is smaller than the pixel area and pixel stacks of each of the at least two pixels in each dimension of each of the plurality of focal planes are arranged to have a ratio of active area to pixel pitch that causes at least a certain amount of desired aliasing in the image information captured by the sampling circuitry.",
"2. The imager array of claim 1, wherein the pixel aperture of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes is formed by a microlens that is smaller than the pixel area.",
"3. The imager array of claim 2, wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in the at least two pixels in each dimension of each of the plurality of focal planes.",
"4. The imager array of claim 3, wherein light is prevented from entering the pixel stacks through the gaps between the adjacent microlenses by a light blocking material.",
"5. The imager array of claim 4, wherein photoresist is located in the gaps between the adjacent microlenses.",
"6. The imager array of claim 2, wherein the amount of aliasing in the image information captured by one of the plurality of focal planes is greater than the amount of aliasing that would be present were the microlens to occupy the entire pixel area defined by the pixel stack.",
"7. The imager array of claim 2, wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes further comprises an oxide layer and the microlens sits atop the oxide layer.",
"8. The imager array of claim 7, wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes includes a color filter.",
"9. The imager array of claim 8, wherein the color filter in the pixel stack of each pixel in the at least two pixels in each dimension of a one of the plurality of focal planes is the same.",
"10. The imager array of claim 8, wherein the color filters in the pixel stacks of the pixels in the at least two pixels in each dimension of a one of the plurality of focal planes form a Bayer filter pattern.",
"11. The imager array of claim 7, wherein the pixel stack of each pixel in the at least two pixels in each dimension of a one of the plurality of focal planes does not include a color filter.",
"12. The imager array of claim 7, wherein the pixel stack of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes includes a nitride passivation layer and a bottom oxide layer that provides support and isolation for metal interconnects.",
"13. The imager array of claim 1, wherein the pixel aperture of each pixel in the at least two pixels in each dimension of each of the plurality of focal planes is formed using at least one light blocking material.",
"14. An array camera module, comprising: an imager array configured to capture light field image data, comprising: a plurality of focal planes, where each of the plurality of focal planes comprises a two dimensional arrangement of pixels having at least two pixels in each dimension and each of the plurality of focal planes is contained within a region of the imager array that does not contain pixels from another one of the plurality of focal planes; control circuitry configured to control the capture of image information from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes; and sampling circuitry configured to convert pixel outputs from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes into digital pixel data; wherein each pixel from the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes comprise a pixel stack including a microlens and an active area, where light incident on the surface of the microlens is focused onto the active area by the microlens and the active area samples the incident light to capture image information; wherein the pixel stack in each pixel defines a pixel area and includes a pixel aperture, where the size of the pixel aperture is smaller than the pixel area; an optic array of lens stacks, where each of the lens stacks in the optical array form an image including aliasing on a particular one of the plurality of focal planes; and wherein pixel stacks of each of the at least two pixels in each dimension of each of the plurality of focal planes are arranged to have a ratio of active area to pixel pitch that causes at least a certain amount of desired aliasing in the image information captured by the sampling circuitry.",
"15. The array camera module of claim 14, wherein the pixel aperture is formed by a microlens that is smaller than the pixel area.",
"16. The array camera module of claim 15, wherein gaps exist between adjacent microlenses in the pixel stacks of adjacent pixels in a particular one of the plurality of focal planes.",
"17. The array camera module of claim 16, wherein light is prevented from entering the pixel stacks of the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes through the gaps between the microlenses by a light blocking material.",
"18. The array camera module of claim 17, wherein photoresist is located in the gaps between the microlenses.",
"19. The array camera module of claim 15, wherein the amount of aliasing in images captured by a one of the plurality of focal planes is greater than the amount of aliasing that would be present were the microlens of the at least two pixels in each dimension of the two dimensional arrangement of pixels within each of the plurality of focal planes to occupy the entire pixel area defined by the pixel stack."
],
"description_excerpt": "The present invention relates to super-resolution processing and more specifically to controlling aliasing in an array camera during super-resolution processing.\n\nIn a typical imaging device, light enters through an opening (aperture) at one end of the imaging device and is directed to an image sensor by one or more optical elements such as lenses. The image sensor includes pixels that generate signals upon receiving light via the optical element. Commonly used image sensors include charge-coupled device image sensors (CCDs) and complementary metal-oxide semiconductor (CMOS) sensors.\n\nConventional digital cameras typically achieve color separation by performing color separation in the optical path and using a separate image sensor for the wavelengths of light corresponding to each of the primary colors (i.e. RGB), using an image sensor with color separation and multiple signal collection capability within each pixel, or by applying filters over a single sensor so that individual pixels detect wavelengths of light corresponding to one of the primary colors. Use of filters is particularly common in cameras that have a small form factor, such as cameras incorporated in mobile phone handsets and other consumer electronics devices including but not limited to, laptop computers and televisions. A common filter that is formed on image sensors is the Bayer filter, the pattern of which includes 50% green filters, 25% red filters, and 25% blue filters. The output of an image sensor to which a Bayer filter is applied can be reconstructed as a color image using interpolation techniques.",
"cpc": [
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],
"assignees": [
"Fotonation Cayman Ltd"
],
"inventors": [
"Dan Lelescu",
"Kartik Venkataraman"
],
"filing_date": "2015-07-30",
"publication_date": "2017-08-15",
"grant_date": "2017-08-15",
"priority_date": "2013-03-13",
"application_number": "US-201514814297-A",
"family_id": "51525762",
"cited_by_count": 87,
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