Coating on PDC/TSP cutter for accelerated leaching

{
  "publication_number": "US9776917B2",
  "country": "US",
  "kind": "B2",
  "title": "Coating on PDC/TSP cutter for accelerated leaching",
  "abstract": "A cutting element includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element.",
  "claims": [
    "1. A method for leaching a cutting element, comprising: providing a cutting element, the cutting element comprising a substrate and polycrystalline diamond layer attached to the substrate; masking at least the substrate portion of the cutting element with a mask using chemical vapor deposition or physical vapor deposition, leaving an unmasked portion of the diamond layer of the cutting element; placing the masked cutting element in a leaching agent, wherein at least the unmasked portion of the cutting element contacts the leaching agent; and removing the masked cutting element from the leaching agent.",
    "2. The method of claim 1, further comprising removing the mask.",
    "3. The method of claim 1, wherein the step of placing the masked cutting element in the leaching agent further comprises holding the masked cutting element in place.",
    "4. The method of claim 1, wherein the masked cutting element is held in place by a magnetic capturing device.",
    "5. The method of claim 1, wherein the mask comprises diamond-like carbon.",
    "6. The method of claim 1, wherein the mask comprises a material selected from a chemical resistant air dry ink and a chemical resistant UV cured ink.",
    "7. The method of claim 1, wherein the mask comprises an institute mask.",
    "8. The method of claim 1, wherein the step of masking comprises encasing the cutting element with a mask material using injection molding.",
    "9. A method of leaching a cutting element, comprising: providing a cutting element, comprising a substrate and polycrystalline diamond layer attached to the substrate; fitting at least the substrate portion of the cutting element in a pre-formed mask, leaving an unmasked portion of the diamond layer of the cutting element; placing the pre-formed mask and the cutting element in a vacuum and applying heat to the pre-formed mask to tighten the pre-formed mask around the cutting element; applying a second layer at the interface of the pre-formed mask and the cutting element covering a portion of the pre-formed mask and a portion of the cutting element; placing the cutting element in a leaching agent, wherein at least the unmasked portion of the cutting element contacts the leaching agent; and removing the cutting element from the leaching agent.",
    "10. The method of claim 9, further comprising sealing the pre-formed mask to the cutting element.",
    "11. The method of claim 9, further comprising removing the pre-formed mask.",
    "12. The method of claim 9, wherein the pre-formed mask comprises polyvinylchloride.",
    "13. The method of claim 9, wherein the step of placing the cutting element in the leaching agent further comprises holding the cutting element in place.",
    "14. A method of leaching a cutting element, comprising; providing a cutting element, comprising a substrate and polycrystalline diamond layer attached to the substrate; fitting at least the substrate portion of the cutting element in a pre-formed mask, leaving an unmasked portion of the diamond layer of the cutting element; applying a second layer at the interface of the pre-formed mask and the cutting element covering a portion of the pre-formed mask and a portion of the cutting element; placing the cutting element in a leaching agent, wherein at least the unmasked portion of the cutting element contacts the leaching agent, and wherein the masked cutting element is held in place by a magnetic capturing device; and removing the cutting element from the leaching agent.",
    "15. The method of claim 9, wherein the applying the second layer comprises using chemical vapor deposition or physical vapor deposition to apply the second layer at the interface of the pre-formed mask and the cutting element covering a portion of the pre-formed mask and a portion of the cutting element.",
    "16. The method of claim 14, further comprising sealing the pre-formed mask to the cutting element.",
    "17. The method of claim 14, further comprising removing the pre-formed mask.",
    "18. The method of claim 14, wherein the pre-formed mask comprises polyvinylchloride.",
    "19. The method of claim 14, wherein the step of placing the cutting element in the leaching agent further comprises holding the cutting element in place.",
    "20. The method of claim 14, wherein the applying the second layer comprises using chemical vapor deposition or physical vapor deposition to apply the second layer at the interface of the pre-formed mask and the cutting element covering a portion of the pre-formed mask and a portion of the cutting element."
  ],
  "description_excerpt": "Technical Field\n\nEmbodiments disclosed herein relate generally to polycrystalline diamond composites and cutting structures. More particularly, embodiments disclosed herein relate to methods of leaching polycrystalline diamond cutting elements.\n\nBackground Art\n\nPolycrystalline diamond compact (“PDC”) cutters have been used in industrial applications including rock drilling and metal machining for many years. In a typical application, a compact of polycrystalline diamond (PCD) (or other superhard material) is bonded to a substrate material, which is typically a sintered metal-carbide to form a cutting structure. PCD comprises a polycrystalline mass of diamonds (typically synthetic) that are bonded together to form an integral, tough, high-strength mass or lattice. The resulting PCD structure produces enhanced properties of wear resistance and hardness, making PCD materials extremely useful in aggressive wear and cutting applications where high levels of wear resistance and hardness are desired.\n\nA PDC cutting element may be formed by placing a cemented carbide substrate into the container of a press. A mixture of diamond grains or diamond grains and catalyst binder is placed atop the substrate and treated under high pressure, high temperature conditions. In doing so, metal binder (often cobalt) migrates from the substrate and passes through the diamond grains to promote intergrowth between the diamond grains. As a result, the diamond grains become bonded to each other to form the diamond layer, and the diamond layer is in turn bonded to the substrate.",
  "cpc": [
    "C03C 25/68",
    "B22F 2003/244",
    "C22C 1/1094",
    "C22C 26/00",
    "E21B 10/46",
    "E21B 10/54",
    "E21B 10/567"
  ],
  "ipc": [
    "C03C 25/68",
    "E21B 10/54",
    "C22C 1/10",
    "C22C 26/00"
  ],
  "assignees": [
    "Smith International Inc"
  ],
  "inventors": [
    "Ted Tessitore",
    "Anthony Griffo",
    "Yuelin Shen",
    "Youhe Zhang",
    "Madapusi K. Keshavan"
  ],
  "filing_date": "2015-07-17",
  "publication_date": "2017-10-03",
  "grant_date": "2017-10-03",
  "priority_date": "2011-03-29",
  "application_number": "US-201514802827-A",
  "family_id": "46925768",
  "cited_by_count": 28,
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}