Electronic component conveyance device and method of manufacturing taping electronic component array

{
  "publication_number": "US9873574B2",
  "country": "US",
  "kind": "B2",
  "title": "Electronic component conveyance device and method of manufacturing taping electronic component array",
  "abstract": "As an electronic component conveyance device that aligns a stack direction of internal electrodes in an electronic component in a highly reliable manner. An interval between a first sidewall and a second sidewall in a midstream part is larger than an interval P 3 between the first sidewall and the second sidewall in a downstream part. A first magnetic force generation unit is provided lateral to the first sidewall in the midstream part. The height of a center of the first magnetic force generation unit with respect to a bottom surface is larger than P 3 /2.",
  "claims": [
    "1. An electronic component conveyance device comprising: a conveyance path; and a first magnetic force generation unit, the conveyance path including a midstream part and a downstream part connected with the midstream part, each of the midstream part and the downstream part including a bottom surface, a first sidewall, and a second sidewall, the first and second sidewalls being provided at opposite side edges of the bottom surface in a width direction of the bottom surface, the first sidewall and the second sidewall facing each other and being spaced apart with an interval, the interval P 2 in the width direction between the first sidewall and the second sidewall in the midstream part being larger than the interval P 3 in the width direction between the first sidewall and the second sidewall in the downstream part, the first magnetic force generation unit being positioned lateral to the first sidewall in the midstream part, and a height of a center of the first magnetic force generation unit at the lateral position with respect to the bottom surface in an extending direction which is a direction where at least one of the first and second sidewalls extends from the bottom surface being higher than P 3 /2.",
    "2. The electronic component conveyance device according to claim 1, further comprising a second magnetic force generation unit provided lateral to the second sidewall in the midstream part and at a side of the bottom surface opposite to the first magnetic force generation unit in the width direction, wherein the second magnetic force generation unit is arranged at a farther downstream side than the first magnetic force generation unit.",
    "3. The electronic component conveyance device according to claim 2, wherein a distance between a center of the second magnetic force generation unit and the bottom surface is smaller than a distance in the extending direction between the center of the first magnetic force generation unit and the bottom surface.",
    "4. An electronic component conveyance device comprising: a conveyance path; and a first magnetic force generation unit, the conveyance path including a midstream part and a downstream part connected with the midstream part, each of the midstream part and the downstream part including a bottom surface, a first sidewall, and a second sidewall, the first and second sidewalls being provided at opposite side edges of the bottom surface in a width direction of the bottom surface, the first sidewall and the second sidewall facing each other and being spaced apart with an interval, the interval in the width direction between the first sidewall and the second sidewall in the midstream part being larger than the interval in the width direction between the first sidewall and the second sidewall in the downstream part, the first magnetic force generation unit being positioned lateral to the first sidewall in the midstream part, and a distance between a center of the first magnetic force generation unit, and the bottom surface in an extending direction which is a direction where at least one of the first and second sidewalls extends from the bottom surface being larger than a distance between a center of an electronic component being conveyed and the bottom surface in the extending direction, at the lateral position.",
    "5. The electronic component conveyance device according to claim 4, further comprising a second magnetic force generation unit provided lateral to the second sidewall in the midstream part and at a side of the bottom surface opposite to the first magnetic force generation unit in the width direction, wherein the second magnetic force generation unit is arranged at a farther downstream side than the first magnetic force generation unit.",
    "6. The electronic component conveyance device according to claim 5, wherein a distance between a center of the second magnetic force generation unit and the bottom surface is smaller than a distance in the extending direction between the center of the first magnetic force generation unit and the bottom surface.",
    "7. An electronic component conveyance device comprising: a conveyance path; and a first magnetic force generation unit provided stationary relative to the conveyance path, the conveyance path including a bottom surface, a first sidewall, and a second sidewall, the first sidewall and the second sidewall facing each other and being spaced apart with an interval, the first magnetic force generation unit being provided lateral to the first sidewall, and the bottom surface having a separating structure that a portion of a lower surface of an electronic component being conveyed is spaced apart from the bottom surface.",
    "8. The electronic component conveyance device according to claim 7, wherein the separating structure is one of a protrusion defined by a portion of the bottom surface being protruded and a recess defined by a portion of the bottom surface being recessed.",
    "9. The electronic component conveyance device according to claim 7, wherein the separating structure is such a level difference in the bottom surface that the bottom surface is lower on a downstream side.",
    "10. The electronic component conveyance device according to claim 7, wherein the separating structure is a curved surface of the bottom surface.",
    "11. The electronic component conveyance device according to claim 7, wherein the conveyance path includes a midstream part and a downstream part connected with the midstream part, the bottom surface, the first sidewall, and the second sidewall define the midstream part and the downstream part, an interval in a width direction of the bottom surface between the first sidewall and the second sidewall in the midstream part is larger than an interval in the width direction between the first sidewall and the second sidewall in the downstream part, the first magnetic force generation unit is provided lateral to the first sidewall in the midstream part, and the separating structure is included in the bottom surface in the midstream part.",
    "12. The electronic component conveyance device according to claim 11, further comprising a second magnetic force generation unit provided lateral to the second sidewall in the midstream part and at a side of the bottom surface opposite to the first magnetic force generation unit in the width direction, wherein the second magnetic force generation unit is arranged at a farther downstream side than the first magnetic force generation unit.",
    "13. An electronic component conveyance device comprising: a conveyance path; and a first magnetic force generation unit provided stationary relative to the conveyance path, the conveyance path including a bottom surface, a first sidewall, and a second sidewall, the first sidewall and the second sidewall facing each other and being spaced apart with an interval, the first magnetic force generation unit being provided lateral to the first sidewall, and further including a floating mechanism that separates a portion of a lower surface of an electronic component being conveyed off the bottom surface by air pressure.",
    "14. The electronic component conveyance device according to claim 13, wherein the floating mechanism includes a blowing mechanism that blows gas upwardly from the bottom surface.",
    "15. The electronic component conveyance device according to claim 13, wherein the floating mechanism includes a suction mechanism that sucks an electronic component from above.",
    "16. The electronic component conveyance device according to claim 13, wherein the conveyance path includes a midstream part and a downstream part connected with the midstream part, the bottom surface, the first sidewall, and the second sidewall define the midstream part and the downstream part, an interval between the first sidewall and the second sidewall in the midstream part is larger than an interval between the first sidewall and the second sidewall in the downstream part, the first magnetic force generation unit is provided lateral to the first sidewall in the midstream part, and the floating mechanism is provided in the midstream part.",
    "17. A method of manufacturing a taping electronic component array, the method comprising steps of: aligning stack directions of a plurality of internal conductors in the electronic components using the electronic component conveyance device according to claim 1; and housing the electronic components of which the stack directions are aligned into recesses in a tape to obtain a taping electronic component array including the tape and the electronic components housed in the recesses."
  ],
  "description_excerpt": "The present disclosure relates to an electronic component conveyance device and a method of manufacturing a taping electronic component array.\n\nA multilayer ceramic capacitor is a known electronic component. The multilayer ceramic capacitor includes a stack of a plurality of internal electrodes and ceramic dielectric layers.\n\nThe multilayer ceramic capacitor is typically mounted on a substrate for use. The mechanical strength or floating capacitance of the multilayer ceramic capacitor mounted on the substrate may differ depending on whether the stack direction of the internal electrodes is parallel to or vertical to the surface of the substrate.\n\nIn addition, the loudness of acoustic noise may differ depending on whether the stack direction of the internal electrodes is parallel to or vertical to the surface of the substrate. The “acoustic noise” is sound generated by oscillation of the substrate caused by distortion of the multilayer ceramic capacitor transferred to the substrate when the distortion occurs due to variation in applied voltage.\n\nFor these reasons, the multilayer ceramic capacitor is desirably mounted on the substrate with the stack direction of the internal electrodes being aligned in a predetermined direction.\n\nJP 2011-018698 A discloses an exemplary electronic component conveyance device that aligns the multilayer ceramic capacitor in the predetermined direction. The conveyance device disclosed in JP 2011-018698 A includes a first conveyance path, a rotation path, and a second conveyance path.",
  "cpc": [
    "B65G 54/02",
    "B65B 15/04",
    "B65B 35/56",
    "B65G 2201/02",
    "B65G 2207/06",
    "B65G 51/03",
    "H01G 13/00",
    "H01G 4/30",
    "H05K 13/022",
    "H05K 13/028"
  ],
  "ipc": [
    "B65G 47/24",
    "B65G 51/03",
    "B65G 54/02",
    "H05K 13/02"
  ],
  "assignees": [
    "Murata Manufacturing Co Ltd"
  ],
  "inventors": [
    "Masaru KAKUHO",
    "Mitsuo Ebata",
    "Naoto Tanaka"
  ],
  "filing_date": "2016-06-14",
  "publication_date": "2018-01-23",
  "grant_date": "2018-01-23",
  "priority_date": "2015-06-16",
  "application_number": "US-201615182075-A",
  "family_id": "57587615",
  "cited_by_count": 4,
  "citations": [
    "US5600906A",
    "US6123184A",
    "JP2011018698A",
    "US20120138350A1",
    "US20150129107A1"
  ]
}