Microcapsule type curable resin composition

{
  "publication_number": "US9969914B2",
  "country": "US",
  "kind": "B2",
  "title": "Microcapsule type curable resin composition",
  "abstract": "A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 μm, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 μm, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).",
  "claims": [
    "1. A microcapsule type curable resin composition containing: (A) a microcapsule encapsulating a curable compound (a); (B) a substance able to bring about curing of the component (a); and (C) a binder able to adhere the microcapsule to an adherend, characterized in that the microcapsule type curable resin composition includes, per total 100 parts by mass of all of the microcapsules, (D) 1 to 25 parts by mass of mica having an average particle diameter of 10 to 150 μm, and (E) 1 to 25 parts by mass of an inorganic filler (except the mica) having an average particle diameter of 3 to 50 μm, a mass ratio of the component (D) and the component (E) being 0.2 to 2.0 of the component (E) with respect to 1.0 of the component (D).",
    "2. The microcapsule type curable resin composition according to claim 1, wherein the component (E) is selected from the group consisting of diatomaceous earth, talc and silica.",
    "3. The microcapsule type curable resin composition according to claim 1, wherein the average particle diameter of the component (D) is 100 to 150 μm.",
    "4. The microcapsule type curable resin composition according to claim 1, wherein the average particle diameter of the component (E) is 5 to 30 μm.",
    "5. The microcapsule type curable resin composition according to claim 1, wherein the component (D) is in a flake state.",
    "6. The microcapsule type curable resin composition according to claim 1, wherein the mass ratio of the component (D) and the component (E) is 0.3 to 1.5 of the component (E) with respect to 1.0 of the component (D).",
    "7. The microcapsule type curable resin composition according to claim 1, wherein the component (a) is one or more kinds selected from the group consisting of a (meth)acrylate compound and an epoxy compound.",
    "8. The microcapsule type curable resin composition according to claim 1, wherein an average particle diameter of the component (A) is 50 to 500 μm.",
    "9. The microcapsule type curable resin composition according to claim 1, wherein the adherend is a threaded member."
  ],
  "description_excerpt": "The present invention relates to a microcapsule type curable resin composition, and more particularly relates to a microcapsule type curable resin composition, for example, used for bonding, locking etc. a threaded member (a screw-type fastening fixture) such as screw.\n\nConventionally, a microcapsule type adhesive for adhering a threaded member such as screw, bolt, nut, and machine screw is well known. Furthermore, it is known that an inorganic filler such as silica, alumina, and calcium carbonate is blended with the microcapsule type adhesive for purposes of efficiently breaking the microcapsule, controlling fluidity of the adhesive, enhancing viscosity of the adhesive and the like. For example, a fastener in which a film of an adhesive composition comprising a monomer with (meth)acryloyl group emulsified into water by a polymer with film-forming ability, an encapsulated organic peroxide with an amino resin as a wall film, and a reducing agent which forms redox with the organic peroxide is formed on a screw portion is known, and the fastener is characterized in that the film is formed by repeatedly applying and drying the adhesive composition several times (Patent Document 1). It is described that, in the adhesive composition, fine powder of silica, alumina or calcium carbonate, potassium titanate fibers, and a glassy or ceramic microballoon may be added as a torque adjusting agent in the amount of 30 weight parts or less with respect to 100 weight parts of the monomer with (meth)acryloyl group. In the example, borosilicate glass with a particle diameter of 40 to 50 μm is used.",
  "cpc": [
    "C09J 163/00",
    "C08F 2/00",
    "C08F 2/20",
    "C08F 2/44",
    "C08F 2222/1013",
    "C08F 2222/1093",
    "C08G 59/188",
    "C08G 59/245",
    "C08G 59/50",
    "C08K 2201/003",
    "C08K 2201/014",
    "C08K 3/34",
    "C08K 3/346",
    "C08K 3/36",
    "C08L 63/00",
    "C09J 133/14",
    "C09J 4/06",
    "F16B 39/225"
  ],
  "ipc": [
    "C08F 2/00",
    "C08F 2/20",
    "C08F 2/44",
    "C08G 59/00",
    "C08G 59/18",
    "C08G 59/24",
    "C08G 59/50",
    "C08K 3/34",
    "C08K 3/36",
    "C08L 63/00",
    "C09J 133/14",
    "C09J 163/00",
    "C09J 4/06",
    "F16B 39/22"
  ],
  "assignees": [
    "Three Bond Fine Chemical Co Ltd"
  ],
  "inventors": [
    "Tomohiro Onoda",
    "Kunihiko Kamata",
    "Yasuo Maeda"
  ],
  "filing_date": "2014-09-08",
  "publication_date": "2018-05-15",
  "grant_date": "2018-05-15",
  "priority_date": "2013-09-25",
  "application_number": "US-201415023524-A",
  "family_id": "52742977",
  "cited_by_count": 0,
  "citations": [
    "US4293677A",
    "US4237252A",
    "JPS641780A",
    "JPH01108284A",
    "JPH03292378A",
    "JPH0742719A",
    "JPH09249872A",
    "JPH10130587A",
    "JPH10252177A",
    "JPH1150013A",
    "JPH11349917A",
    "JP2000191745A",
    "JP2000239438A",
    "JP2002212513A",
    "WO2005054393A1",
    "JP4715517B2",
    "JP2008056891A",
    "JP2010205498A",
    "JP2012010908A"
  ]
}