MLchartDataset catalogue

Patents full text · MLC-0201

CPC subclass H05K

Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components

230 patents · page 3 of 3

Table 1. Patents
No.PublicationTitlePublishedAssignee
201US6515230B1Noise absorber and case for noise absorber2003-02-04TDK Corp
202US6492443B1Norbornene polymer composition2002-12-10Nippon Zeon Co Ltd
203US6469900B2Apparatus for locking and ejecting a module device2002-10-22Quanta Computer Inc
204US6456498B1CompactPCI-based computer system with mid-plane connector for equivalent front and back loading2002-09-24Hewlett Packard Co
205US6395334B1Multiple head dispensing method2002-05-28Speedline Technologies Inc
206US6356441B1Disk drive assembly with improved securing and releasing mechanism2002-03-12EMC Corp
207US6262706B1Retroreflective electrophoretic displays and materials for making the same2001-07-17E Ink Corp
208US6238508B1Bonding method using fast hardening UV adhesive and slower hardening adhesive2001-05-29Robert Bosch GmbH
209US6222736B1Computer with component installation handle2001-04-24Dell USA LP
210US6215673B1Hot plug PCI retainer and actuator2001-04-10Intel Corp
211US6170784B1Cable management device2001-01-09Polygon Wire Management Inc
212US6160696AModular bus bar and switch assembly for traction inverter2000-12-12General Electric Co
213US6136128AMethod of making an adhesive preform lid for electronic devices2000-10-24Amerasia International Technology Inc
214US6114674AMultilayer circuit board with electrically resistive heating element2000-09-05Mcdonnell Douglas Corp
215US5969941ADevice for mounting fan in a portable computer1999-10-19Samsung Electronics Co Ltd
216US5864833AApparatus for optimizing the layout and charge maps of a flowline of pick and place machines1999-01-26Philips Electronics North America Corp
217US5655704AMethod and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component1997-08-12Matsushita Electric Industrial Co Ltd
218US5648123AProcess for producing a strong bond between copper layers and ceramic1997-07-15Hoechst AG
219US5611274AApparatus for screen printing of viscous materials1997-03-18Tani Denkikogyo Co Ltd
220US5477416AEnclosure with metered air ducts for mounting and cooling modules1995-12-19Hewlett Packard Co
221US5397608APlastic article containing electrically conductive fibers1995-03-14
222US5368643ACoating apparatus for boards1994-11-29Ciba Geigy Corp
223US5259495ABelt tensioner and turnover device for a printed circuit board belt conveyor1993-11-09Simplimatic Engineering Co
224US5225629ASnap-in EMI contact associated with a digital computer1993-07-06Dell USA LP
225US4952342ADual cure method for making a rotted electrical/mechanical device1990-08-28Henkel Loctite Corp
226US4482938AElectrical apparatus with plug-in modules1984-11-13
227US4070753AAutomatic insertion machine for inserting radial lead electronic components1978-01-31
228US3989164AMagnetic handling equipment1976-11-02ITT Industries Inc
229US3757406ATool for removing and inserting modules1973-09-11Techni-Tool Inc
230US3733655AFastener device1973-05-22

230 records in this listing. Patents full text (MLC-0201). Request the full dataset.