MLchartDataset catalogue

Electroforming

Term · Environment · MLC-T-ENV-009141

Electrolytic process using or emitting any of the plating and polishing metal HAP, as defined in this section, that is used for fabricating metal parts. This process is essentially the same as electroplating except that the plated substrate (mandrel) is removed, leaving only the metal plate. In electroforming, the metal plate is self-supporting and generally thicker than in electroplating.

Table 1. Record
IdentifierMLC-T-ENV-009141
FieldEnvironment
References40 CFR 63.11511 (CFR 2013)
Record as JSON
{
  "id": "MLC-T-ENV-009141",
  "term": "Electroforming",
  "field": "Environment",
  "definition": "Electrolytic process using or emitting any of the plating and polishing metal HAP, as defined in this section, that is used for fabricating metal parts. This process is essentially the same as electroplating except that the plated substrate (mandrel) is removed, leaving only the metal plate. In electroforming, the metal plate is self-supporting and generally thicker than in electroplating.",
  "references": [
    "40 CFR 63.11511 (CFR 2013)"
  ],
  "url": "https://mlchart.com/terminology/environment/electroforming/"
}

Record 9,141 of 30,736 in Environment terminology (MLC-0121). Request the full dataset.