MLchartDataset catalogue

Photoresist Application

Term · Environment · MLC-T-ENV-020933

Operation that uses heat and pressure to apply a photoresist coating to a printed wiring board. Water is not used in this operation.

Table 1. Record
IdentifierMLC-T-ENV-020933
FieldEnvironment
References40 CFR 438 Appendix C (CFR 2013)
Record as JSON 
{
  "id": "MLC-T-ENV-020933",
  "term": "Photoresist Application",
  "field": "Environment",
  "definition": "Operation that uses heat and pressure to apply a photoresist coating to a printed wiring board. Water is not used in this operation.",
  "references": [
    "40 CFR 438 Appendix C (CFR 2013)"
  ],
  "url": "https://mlchart.com/terminology/environment/photoresist-application/"
}

Record 20,933 of 30,736 in Environment terminology (MLC-0121). Request the full dataset.