Plating and Polishing Facility

{
  "id": "MLC-T-ENV-021262",
  "term": "Plating and Polishing Facility",
  "field": "Environment",
  "definition": "Facility engaged in one or more of the following processes that uses or emits any of the plating and polishing metal HAP, as defined in this section: electroplating processes other than chromium electroplating (i.e., non-chromium electroplating); electroless plating; other non-electrolytic metal coating processes performed in a tank, such as chromate conversion coating, nickel acetate sealing, sodium dichromate sealing, and manganese phosphate coating; thermal spraying; and the dry mechanical polishing of finished metals and formed products after plating or thermal spraying. Plating is performed in a tank or thermally sprayed so that a metal coating is irreversibly applied to an object. Plating and polishing does not include any bench-scale processes.",
  "references": [
    "40 CFR 63.11511 (CFR 2013)"
  ],
  "url": "https://mlchart.com/terminology/environment/plating-and-polishing-facility/"
}