Pick and place tooling with adjustable nozzle configuration

{
  "publication_number": "US10681851B2",
  "country": "US",
  "kind": "B2",
  "title": "Pick and place tooling with adjustable nozzle configuration",
  "abstract": "Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.",
  "claims": [
    "1. A pick and place head comprising: a base plate, wherein the base plate is a solid material having bored vacuum channels and a vacuum connection for coupling a vacuum to the vacuum channels; and a plurality of nozzle subassemblies removably coupled to the base plate, wherein individual nozzle subassemblies comprise a vacuum nozzle and a hose barb for connecting a vacuum hose, wherein a first end of the vacuum hose is connected to the hose barb and a second end of the vacuum hose is connected to a vacuum channel on the base plate.",
    "2. The pick and place head of claim 1, further comprising: a top plate coupled to the base plate having a plurality of openings, wherein individual nozzle subassemblies are seated in individual openings in the top plate.",
    "3. The pick and place head of claim 2, wherein the top plate material is selected from the group consisting of aluminum, aluminum alloy, plastic, steel, and steel alloy.",
    "4. The pick and place head of claim 1, wherein individual nozzle subassemblies are removably coupled to the base plate by a magnet.",
    "5. The pick and place head of claim 1, wherein individual nozzle subassemblies further comprise: a plurality of openings on the base; and a seal, wherein the seal is exchangeable with the hose barb, and wherein individual openings on the base include the seal or the hose barb.",
    "6. The pick and place head of claim 1, wherein the base plate is reusable.",
    "7. The pick and place head of claim 1, wherein individual nozzle subassemblies are reusable."
  ],
  "description_excerpt": "This disclosure relates generally to the field of fabrication and testing of integrated circuit devices using pick and place tooling and, in particular, methods and apparatuses for a pick and place head.\n\nThe demand for higher performance electronic devices, including integrated circuits or semiconductor chips, at a lower cost is requiring more precise and higher-throughout manufacturing. Trays holding arrays of components, where each component is placed in an individual cell within the array, are used for transport and handling during fabrication and testing. The components are removed from and replaced in the tray by a “pick and place” device. A pick and place device typically has multiple vacuum grippers or nozzles, arranged in rows and columns, to pick up and to place a plurality of components. The pitch or spacing between the cells in the array may vary between different tray types and may vary depending on the component and the product being manufactured. Traditional pick-and-lace heads have fixed nozzle placement and fixed vacuum connections that are tapped and drilled into a solid base plate. Other pick and place devices have multiple nozzles mounted on a horizontal bar, and multiple horizontal bars stacked vertically, where the pitch may be adjusted by moving the nozzles along the horizontal bar and by moving the multiple horizontal bars vertically.\n\nEmbodiments described herein illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar features.",
  "cpc": [
    "H05K 13/0404",
    "B23P 19/00",
    "B25J 15/0061",
    "B25J 15/0616",
    "B25J 15/0683",
    "G01R 31/26",
    "G01R 31/2642",
    "G01R 31/2867",
    "H01L 21/67144",
    "H01L 21/6838",
    "H05K 13/0409",
    "H05K 13/041",
    "H05K 3/32",
    "H10P 72/0446",
    "H10P 72/78",
    "Y10T 29/53174"
  ],
  "ipc": [
    "B23P 19/00",
    "B25J 15/00",
    "B25J 15/06",
    "G01R 31/26",
    "G01R 31/28",
    "H01L 21/67",
    "H01L 21/683",
    "H05K 13/04",
    "H05K 3/32"
  ],
  "assignees": [
    "INTEL CORP"
  ],
  "inventors": [
    "ZIADEH BASSAM MOHAMMED",
    "ILA ALIN",
    "HECKATHORNE NATHAN P"
  ],
  "filing_date": "2017-06-22",
  "publication_date": "2020-06-09",
  "grant_date": "2020-06-09",
  "priority_date": "2017-06-22",
  "application_number": "US-201715629908-A",
  "family_id": "64693012",
  "citations": [
    "US2003182796A1",
    "US2015173260A1",
    "US2016227682A1",
    "US2017120452A1",
    "US5953812A",
    "US6979032B2",
    "US7950708B2",
    "US9586325B2"
  ]
}