Patent · US10968340B1 · B1 · US

Electrically conductive, high strength, high temperature polymer composite for additive manufacturing

(11) Publication number

US10968340B1

(21) Application number

15/883,800

(22) Filing date

2018-01-30

(30) Priority date

2017-01-31

(43) Publication date

2021-04-06

(45) Date of grant

2021-04-06

(52) CPC

C08L Compositions of macromolecular compounds: 27/18, 77/00, 77/02, 79/08, 81/04, 81/06, 83/04
B29C Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing: 48/02, 48/022, 48/29, 48/92, 64/124, 70/023, 70/882
B29K Indexing scheme associated with subclasses B29B, B29C or B29D, relating to moulding materials or to materials for {moulds, } reinforcements, fillers or preformed parts, e.g. inserts: 2071/00, 2077/00, 2507/04, 2509/08
B33Y Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering: 70/10
C08G Macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds: 77/16, 77/80
C08K Use of inorganic or non-macromolecular organic substances as compounding ingredients: 2003/0806, 2003/085, 2201/001, 2201/005, 3/04, 3/041, 3/042, 3/08, 5/54, 5/549, 7/06

(73) Assignee

EATON INTELLIGENT POWER LTD

(54) Title

Electrically conductive, high strength, high temperature polymer composite for additive manufacturing

(57) Abstract

A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.

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Claims (20)

An electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system, the deposition material comprising: a polymer component in an amount of from 30 wt % to 99.85 wt % based on the weight of the deposition material; wherein the polymer component comprises a high temperature polymer; a filler component in an amount of from 0.1 wt % to 60 wt % based on the weight of the deposition material; wherein the filler component comprises a strengthening component and a conductive component; and an extrudability component in an amount of from 0.05 wt % to 10 wt % based on the weight of the deposition material; wherein the extrudability component includes a rheological component and a dispersion component; wherein the rheological component is polyhedral oligomeric silsesquioxane (POSS) and the dispersion component is a silane compound such that, in the liquid state, the deposition material is characterized by the filler component uniformly distributed in the polymer component; and wherein the electrically conductive deposition material has an electrical resistance of from 1×10 1 ohms to 1×10 4 ohms.
The deposition material of claim 1, wherein the high temperature polymer is selected from the group consisting of nylon, polyamide 12 (PA12), polyphthalamide (PPA), polyphenylene sulfide (PPS), polyphenylsulfone (PPSU), polyetherimide (PEI), polyamide-imide (PAI), ethylene tetrafluoroethylene (ETFE), fluorinated ethylene propylene (FEP), polyaryletherketone (PAEK), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetheretherketone (PEEK), and combinations thereof.
The deposition material of claim 1, wherein the extrudability component is in an amount of from 0.05 wt % to 5 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the extrudability component is in an amount of from 0.1 wt % to 3 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the filler component is in an amount of from 0.5 wt % to 29 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the filler component comprises the conductive component in an amount of from 0.1 wt % to 10 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the filler component comprises the conductive component in an amount of from 0.5 wt % to 4 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the strengthening component is selected from the group consisting of carbon fibers, glass fibers, basalt fibers, Kevlar fibers, and combinations thereof.
The deposition material of claim 1, wherein the filler component comprises the strengthening component in an amount of from 5 wt % to 50 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the filler component comprises the strengthening component in an amount of from 5 wt % to 25 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the filler component comprises: the conductive component in an amount of from 0.1 wt % to 10 wt % based on the weight of the deposition material; and the strengthening component in an amount of from 5 wt % to 50 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the filler component comprises: the conductive component in an amount of from 0.5 wt % to 4 wt % based on the weight of the deposition material; and the strengthening component in an amount of from 5 wt % to 25 wt % based on the weight of the deposition material.
The deposition material of claim 1, wherein the POSS component is one of trisilanol phenyl POSS and trisilanol isobutyl POSS.
The deposition material of claim 1, the silane compound includes one of trichlorosilane (SiHCl3), tetramethylsilane (Si(CH3)4), and tetraethoxysilane (Si(OC2H5)4).
The deposition material of claim 1, the conductive component including: a first conductive component selected from the group consisting of carbon nanotubes, graphene, carbon black, and combinations thereof; and a second conductive component selected from the group consisting of silver nanoparticles, copper nanoparticles and combinations thereof.
The deposition material of claim 1, wherein the deposition material is an electromagnetic interference/electromagnetic compatibility (EMI/EMC) shielding material.
The deposition material of claim 1, wherein the deposition material solidified from the liquid state after deposition via the additive manufacturing system is characterized by a tensile strength from 50 MPa to 200 MPa.
The deposition material of claim 1, wherein the deposition material solidified from the liquid state, after deposition via the additive manufacturing system, is configured as an electrical circuit for conducting current to an electrical component.
An electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system, the deposition material comprising: a polymer component in an amount of from 30 wt % to 99.85 wt % based on the weight of the deposition material; wherein the polymer component comprises a high temperature polymer; a filler component in an amount of from 0.1 wt % to 60 wt % based on the weight of the deposition material; wherein the filler component comprises a strengthening component and a conductive component; the conductive component including: a first conductive component selected from the group consisting of carbon nanotubes, graphene, carbon black, and combinations thereof; and a second conductive component selected from the group consisting of silver nanoparticles, copper nanoparticles and combinations thereof; an extrudability component in an amount of from 0.05 wt % to 10 wt % based on the weight of the deposition material; wherein the extrudability component includes a rheological component and a dispersion component; wherein the rheological component is polyhedral oligomeric silsesquioxane (POSS) and the dispersion component is a silane compound such that, in the liquid state, the deposition material is characterized by the filler component uniformly distributed in the polymer component; and wherein the electrically conductive deposition material has an electrical resistance of from 1×10 5 ohms to 1×10 8 ohms.
The deposition material of claim 19, wherein the deposition material is an electrostatic discharge (ESD) material.

Citations (16)

CN103146175A
CN103146175B
EP2266786A1
JP2010155953A
US2006183835A1
US2007213475A1
US2010280151A1
US2010283000A1
US2015118430A1
US2015259580A1
US2016090469A1
US7479516B2
US7919013B2
US9284449B2
WO2013182793A1
WO2014186460A1

Record as JSON

{
  "publication_number": "US10968340B1",
  "country": "US",
  "kind": "B1",
  "title": "Electrically conductive, high strength, high temperature polymer composite for additive manufacturing",
  "abstract": "A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.",
  "claims": [
    "1. An electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system, the deposition material comprising: a polymer component in an amount of from 30 wt % to 99.85 wt % based on the weight of the deposition material; wherein the polymer component comprises a high temperature polymer; a filler component in an amount of from 0.1 wt % to 60 wt % based on the weight of the deposition material; wherein the filler component comprises a strengthening component and a conductive component; and an extrudability component in an amount of from 0.05 wt % to 10 wt % based on the weight of the deposition material; wherein the extrudability component includes a rheological component and a dispersion component; wherein the rheological component is polyhedral oligomeric silsesquioxane (POSS) and the dispersion component is a silane compound such that, in the liquid state, the deposition material is characterized by the filler component uniformly distributed in the polymer component; and wherein the electrically conductive deposition material has an electrical resistance of from 1×10 1 ohms to 1×10 4 ohms.",
    "2. The deposition material of claim 1, wherein the high temperature polymer is selected from the group consisting of nylon, polyamide 12 (PA12), polyphthalamide (PPA), polyphenylene sulfide (PPS), polyphenylsulfone (PPSU), polyetherimide (PEI), polyamide-imide (PAI), ethylene tetrafluoroethylene (ETFE), fluorinated ethylene propylene (FEP), polyaryletherketone (PAEK), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetheretherketone (PEEK), and combinations thereof.",
    "3. The deposition material of claim 1, wherein the extrudability component is in an amount of from 0.05 wt % to 5 wt % based on the weight of the deposition material.",
    "4. The deposition material of claim 1, wherein the extrudability component is in an amount of from 0.1 wt % to 3 wt % based on the weight of the deposition material.",
    "5. The deposition material of claim 1, wherein the filler component is in an amount of from 0.5 wt % to 29 wt % based on the weight of the deposition material.",
    "6. The deposition material of claim 1, wherein the filler component comprises the conductive component in an amount of from 0.1 wt % to 10 wt % based on the weight of the deposition material.",
    "7. The deposition material of claim 1, wherein the filler component comprises the conductive component in an amount of from 0.5 wt % to 4 wt % based on the weight of the deposition material.",
    "8. The deposition material of claim 1, wherein the strengthening component is selected from the group consisting of carbon fibers, glass fibers, basalt fibers, Kevlar fibers, and combinations thereof.",
    "9. The deposition material of claim 1, wherein the filler component comprises the strengthening component in an amount of from 5 wt % to 50 wt % based on the weight of the deposition material.",
    "10. The deposition material of claim 1, wherein the filler component comprises the strengthening component in an amount of from 5 wt % to 25 wt % based on the weight of the deposition material.",
    "11. The deposition material of claim 1, wherein the filler component comprises: the conductive component in an amount of from 0.1 wt % to 10 wt % based on the weight of the deposition material; and the strengthening component in an amount of from 5 wt % to 50 wt % based on the weight of the deposition material.",
    "12. The deposition material of claim 1, wherein the filler component comprises: the conductive component in an amount of from 0.5 wt % to 4 wt % based on the weight of the deposition material; and the strengthening component in an amount of from 5 wt % to 25 wt % based on the weight of the deposition material.",
    "13. The deposition material of claim 1, wherein the POSS component is one of trisilanol phenyl POSS and trisilanol isobutyl POSS.",
    "14. The deposition material of claim 1, the silane compound includes one of trichlorosilane (SiHCl3), tetramethylsilane (Si(CH3)4), and tetraethoxysilane (Si(OC2H5)4).",
    "15. The deposition material of claim 1, the conductive component including: a first conductive component selected from the group consisting of carbon nanotubes, graphene, carbon black, and combinations thereof; and a second conductive component selected from the group consisting of silver nanoparticles, copper nanoparticles and combinations thereof.",
    "16. The deposition material of claim 1, wherein the deposition material is an electromagnetic interference/electromagnetic compatibility (EMI/EMC) shielding material.",
    "17. The deposition material of claim 1, wherein the deposition material solidified from the liquid state after deposition via the additive manufacturing system is characterized by a tensile strength from 50 MPa to 200 MPa.",
    "18. The deposition material of claim 1, wherein the deposition material solidified from the liquid state, after deposition via the additive manufacturing system, is configured as an electrical circuit for conducting current to an electrical component.",
    "19. An electrically conductive deposition material extrudable in a fluid state for deposition via an additive manufacturing system, the deposition material comprising: a polymer component in an amount of from 30 wt % to 99.85 wt % based on the weight of the deposition material; wherein the polymer component comprises a high temperature polymer; a filler component in an amount of from 0.1 wt % to 60 wt % based on the weight of the deposition material; wherein the filler component comprises a strengthening component and a conductive component; the conductive component including: a first conductive component selected from the group consisting of carbon nanotubes, graphene, carbon black, and combinations thereof; and a second conductive component selected from the group consisting of silver nanoparticles, copper nanoparticles and combinations thereof; an extrudability component in an amount of from 0.05 wt % to 10 wt % based on the weight of the deposition material; wherein the extrudability component includes a rheological component and a dispersion component; wherein the rheological component is polyhedral oligomeric silsesquioxane (POSS) and the dispersion component is a silane compound such that, in the liquid state, the deposition material is characterized by the filler component uniformly distributed in the polymer component; and wherein the electrically conductive deposition material has an electrical resistance of from 1×10 5 ohms to 1×10 8 ohms.",
    "20. The deposition material of claim 19, wherein the deposition material is an electrostatic discharge (ESD) material."
  ],
  "cpc": [
    "C08L 27/18",
    "B29C 48/02",
    "B29C 48/022",
    "B29C 48/29",
    "B29C 48/92",
    "B29C 64/124",
    "B29C 70/023",
    "B29C 70/882",
    "B29K 2071/00",
    "B29K 2077/00",
    "B29K 2507/04",
    "B29K 2509/08",
    "B33Y 70/10",
    "C08G 77/16",
    "C08G 77/80",
    "C08K 2003/0806",
    "C08K 2003/085",
    "C08K 2201/001",
    "C08K 2201/005",
    "C08K 3/04",
    "C08K 3/041",
    "C08K 3/042",
    "C08K 3/08",
    "C08K 5/54",
    "C08K 5/549",
    "C08K 7/06",
    "C08L 77/00",
    "C08L 77/02",
    "C08L 79/08",
    "C08L 81/04",
    "C08L 81/06",
    "C08L 83/04"
  ],
  "assignees": [
    "EATON INTELLIGENT POWER LTD"
  ],
  "filing_date": "2018-01-30",
  "publication_date": "2021-04-06",
  "grant_date": "2021-04-06",
  "priority_date": "2017-01-31",
  "application_number": "US-201815883800-A",
  "family_id": "75275523",
  "citations": [
    "CN103146175A",
    "CN103146175B",
    "EP2266786A1",
    "JP2010155953A",
    "US2006183835A1",
    "US2007213475A1",
    "US2010280151A1",
    "US2010283000A1",
    "US2015118430A1",
    "US2015259580A1",
    "US2016090469A1",
    "US7479516B2",
    "US7919013B2",
    "US9284449B2",
    "WO2013182793A1",
    "WO2014186460A1"
  ]
}

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