Electrical bonding door hinges

{
  "publication_number": "US11920392B1",
  "country": "US",
  "kind": "B1",
  "title": "Electrical bonding door hinges",
  "abstract": "A hinge assembly includes first and second hinge units and an electrically conductive pin. The first hinge unit is mounted to a frame structure of an enclosure and includes a pin support comprising a barrel, a knuckle, or both, a pin receptacle arranged in the pin support, and an electrically conductive structure disposed at least partly inside the pin support and adjacent the pin receptacle. The pin rotates in the pin receptacle. The second hinge unit is carried on the pin and is door mounted. The second hinge unit and door can be removed from the first. The electrically conductive structure is biased against the pin and remains in contact while the pin rotates, and is electrically connected to the enclosure when the first hinge unit is mounted to it such that the pin is electrically bonded to the enclosure while the pin rotates.",
  "claims": [
    "1. A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising: (a) a first hinge unit, adapted to be mounted to a frame structure of the electronic equipment enclosure, that includes: (i) a pin support comprising a barrel, (ii) a pin receptacle arranged in the pin support, and (iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle; (b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein; and (c) a removable second hinge unit carried on the pin and adapted to be mounted to a door of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure; (d) wherein: (i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and (ii) the electrically conductive bonding element is electrically connected to the frame structure so long as the first hinge unit is mounted to the frame structure, (iii) such that the pin is electrically bonded to the frame structure, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the frame structure; (f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (g) wherein the electrically conductive bonding element is a bonding contact spring biased against the cylindrical surface of the pin; and (h) wherein the bonding contact spring is a simple flat spring, disposed in a recess in the barrel of the pin support, that is bowed in the middle and is thereby biased against the cylindrical surface of the pin.",
    "2. The hinge assembly of claim 1, wherein the hinge assembly is an internal hinge assembly with the pin support being hidden by the door when the door is in the closed state.",
    "3. The hinge assembly of claim 1, wherein the hinge assembly is an external hinge assembly with the pin support visibly wrapping around an outside edge of the door when the door is in the closed state.",
    "4. A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising: (a) a first hinge unit, adapted to be mounted to a frame structure of the electronic equipment enclosure, that includes: (i) a pin support comprising a barrel, (ii) a pin receptacle arranged in the pin support, and (iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle; (b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein; and (c) a removable second hinge unit carried on the pin and adapted to be mounted to a door of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure; (d) wherein: (i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and (ii) the electrically conductive bonding element is electrically connected to the frame structure so long as the first hinge unit is mounted to the frame structure, (iii) such that the pin is electrically bonded to the frame structure, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the frame structure; (f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (g) wherein the electrically conductive bonding element is a bonding contact spring biased against the cylindrical surface of the pin; and (h) wherein the bonding contact spring is a wire spring, staked at one end in a groove in the barrel of the pin support, that applies a constant support against the cylindrical surface of the pin.",
    "5. The hinge assembly of claim 4, wherein the pin includes a groove with which the wire spring engages, thereby acting as a detent for locking the pin in position.",
    "6. The hinge assembly of claim 4, wherein the hinge assembly is an internal hinge assembly with the pin support being hidden by the door when the door is in the closed state.",
    "7. The hinge assembly of claim 4, wherein the hinge assembly is an external hinge assembly with the pin support visibly wrapping around an outside edge of the door when the door is in the closed state.",
    "8. A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising: (a) a first hinge unit, adapted to be mounted to a frame structure of the electronic equipment enclosure, that includes: (i) a pin support comprising a barrel, (ii) a pin receptacle arranged in the pin support, and (iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle; (b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein; and (c) a removable second hinge unit carried on the pin and adapted to be mounted to a door of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure; (d) wherein: (i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and (ii) the electrically conductive bonding element is electrically connected to the frame structure so long as the first hinge unit is mounted to the frame structure, (iii) such that the pin is electrically bonded to the frame structure, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the frame structure; (f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (g) wherein the pin is electrically bonded to the second hinge unit such that the second hinge unit is electrically bonded to the frame structure via bonding between the second hinge unit and the pin, bonding between the pin and the electrically conductive bonding element, bonding between the electrically conductive bonding element and the pin support, and bonding between the pin support and the frame structure; (h) wherein the second hinge unit is electrically connected to the door so long as the second hinge unit is mounted to the door such that the door is electrically bonded to the frame structure via bonding between the door and the second hinge unit, bonding between the second hinge unit and the pin, bonding between the pin and the electrically conductive bonding element, bonding between the electrically conductive bonding element and the pin support, and bonding between the pin support and the frame structure; and (i) wherein the second hinge unit includes a pin housing that is press fit into an opening provided in a structural member of the door.",
    "9. The hinge assembly of claim 8, wherein the pin housing includes a plurality of unpainted ribs that make electrical contact with edges of the opening in the structural member of the door when the pin housing is press fit into the opening.",
    "10. The hinge assembly of claim 8, wherein the pin housing has a key structure that interlocks with the opening in the structural member of the door.",
    "11. The hinge assembly of claim 8, wherein the second hinge unit includes a second pin support comprising a barrel, and wherein the second pin support is electrically connected to the door.",
    "12. The hinge assembly of claim 11, wherein the second pin support is electrically connected to the door via fasteners that make electrical contact with both the door and with the second pin support.",
    "13. The hinge assembly of claim 12, wherein the fasteners utilize paint-cutting surfaces to establish the electrical contact between the door and the second pin support.",
    "14. The hinge assembly of claim 8, wherein the hinge assembly is an internal hinge assembly with the pin support being hidden by the door when the door is in the closed state.",
    "15. The hinge assembly of claim 8, wherein the hinge assembly is an external hinge assembly with the pin support visibly wrapping around an outside edge of the door when the door is in the closed state.",
    "16. A hinge assembly providing built-in electrical bonding for a removable door in an electronic equipment enclosure, comprising: (a) a first hinge unit, adapted to be mounted to a frame structure of the electronic equipment enclosure, that includes: (i) a pin support comprising a barrel, (ii) a pin receptacle arranged in the pin support, and (iii) an electrically conductive bonding element disposed at least partly inside the pin support and adjacent the pin receptacle; (b) an electrically conductive pin disposed in the pin receptacle and arranged to rotate therein; and (c) a removable second hinge unit carried on the pin and adapted to be mounted to a door of the electronic equipment enclosure, thereby supporting the door on the frame structure in a hinged relationship, wherein the second hinge unit can be removed from the first hinge unit to enable the door to be removed from the frame structure; (d) wherein: (i) the electrically conductive bonding element is biased against the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state, and (ii) the electrically conductive bonding element is electrically connected to the frame structure so long as the first hinge unit is mounted to the frame structure, (iii) such that the pin is electrically bonded to the frame structure, via the biased electrically conductive bonding element, while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (e) wherein the electrically conductive bonding element is electrically connected to the pin support, and wherein the pin support is electrically connected to the frame structure; (f) wherein the pin includes a cylindrical surface, and wherein the electrically conductive bonding element is biased against the cylindrical surface of the pin when the pin is disposed in the pin receptacle and remains in contact with the pin while the pin rotates within the pin receptacle from an open state to a closed state and from the closed state to the open state; (g) wherein the pin is electrically bonded to the second hinge unit such that the second hinge unit is electrically bonded to the frame structure via bonding between the second hinge unit and the pin, bonding between the pin and the electrically conductive bonding element, bonding between the electrically conductive bonding element and the pin support, and bonding between the pin support and the frame structure; and (h) wherein the second hinge unit includes a pin housing supporting a return spring that biases the pin into position in the pin receptacle but which, when a biasing force is overcome, permits the pin to be withdrawn from the pin receptacle such that the second hinge unit may be removed from the first hinge unit.",
    "17. The hinge assembly of claim 16, wherein the return spring makes electrical contact with both the pin and the pin housing, thereby establishing the electrical bonding between the pin and the second hinge unit.",
    "18. The hinge assembly of claim 17, wherein the return spring is a coil spring arranged coaxially around the pin.",
    "19. The hinge assembly of claim 16, wherein the hinge assembly is an internal hinge assembly with the pin support being hidden by the door when the door is in the closed state.",
    "20. The hinge assembly of claim 16, wherein the hinge assembly is an external hinge assembly with the pin support visibly wrapping around an outside edge of the door when the door is in the closed state."
  ],
  "description_excerpt": "All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved.\n\nThe present invention relates generally to electrical bonding in an electronic equipment enclosure, and, in particular, to electrically bonding the door of an enclosure to the frame.\n\nIn any device or system utilizing electrical power, it is important to reduce electrical safety and operational issues via proper grounding and/or bonding. The electrical protection of today's high-speed cabling systems is an essential part of a properly designed and installed information and communications technology (ICT) infrastructure. A bonding and grounding system will aid in controlling negative influences such as electromagnetic interference (EMI), electrostatic discharge (ESD) or ground potential rise from lightning.\n\nThe idea in electrical bonding is to bring a series of devices or structures to the same electrical potential so that a fault current does not cause one element of the system to become energized or “hot” (leading to a shock or fire hazard). Bonding prevents this because, without potential differences, there is no voltage differential seeking a path. In the event of a fault, the current automatically eases and helps prevent a structure from going hot.",
  "cpc": [
    "E05D 11/0081",
    "E05D 11/1014",
    "E05D 2005/102",
    "E05D 5/12",
    "E05D 7/1011",
    "E05Y 2400/65",
    "E05Y 2900/132",
    "E05Y 2900/208"
  ],
  "ipc": [
    "E05D 11/00",
    "E05D 11/10",
    "E05D 5/12"
  ],
  "assignees": [
    "Chatsworth Products Inc"
  ],
  "inventors": [
    "William Drew Krietzman",
    "Preston Ellis HENNRICH",
    "John Wayne Robertson"
  ],
  "filing_date": "2022-01-31",
  "publication_date": "2024-03-05",
  "grant_date": "2024-03-05",
  "priority_date": "2021-02-02",
  "application_number": "US-202217589724-A",
  "family_id": "90061995",
  "cited_by_count": 10,
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