Image sensor and method of manufacturing the same

{
  "publication_number": "US2008272416A1",
  "country": "US",
  "kind": "A1",
  "title": "Image sensor and method of manufacturing the same",
  "abstract": "Provided is an image sensor and method of manufacturing the same. The image sensor can include a semiconductor substrate, a metal interconnection layer, an inorganic layer, lens seed patterns, and microlenses. The semiconductor substrate can include unit pixels. The metal interconnection layer can be disposed on the semiconductor substrate to provide signal and poser connections to the unit pixels. The inorganic layer can be disposed on the metal interconnection layer. The lens seed patterns are selectively disposed on the inorganic layer and are formed of an organic material. The microlenses are formed on the lens seed patterns.",
  "claims": [
    "1. An image sensor, comprising: an inorganic layer on a substrate including unit pixels; lens seed patterns selectively disposed on the inorganic layer, the lens seed patterns comprising an organic material; and microlenses on the lens seed patterns.",
    "2. The image sensor according to claim 1, wherein the lens seed patterns comprise a thermal resin.",
    "3. The image sensor according to claim 1, wherein the lens seed layer has a thickness of about 10 nm to 1,000 nm.",
    "4. The image sensor according to claim 1, wherein the lens seed patterns are spaced apart from each other on the inorganic layer such that each of the lens seed patterns corresponds to one of the unit pixels.",
    "5. The image sensor according to claim 1, wherein the inorganic layer comprises a hydrophilic oxide layer.",
    "6. The image sensor according to claim 5, wherein the inorganic layer comprises a d-tetraethyl orthosilicate (d-TEOS) layer or a low temperature oxide (LTO) layer.",
    "7. The image sensor according to claim 1, wherein the microlenses comprise a hydrophobic organic material.",
    "8. A method of manufacturing an image sensor, comprising: forming an inorganic layer on a semiconductor substrate including unit pixels; selectively forming lens seed patterns comprising an organic material on the inorganic layer; and forming microlenses on the lens seed patterns.",
    "9. The method according to claim 8, wherein the forming of the lens seed patterns comprises: forming gap patterns on the inorganic layer; forming a lens seed layer on the inorganic layer and the gap patterns using a coating process; and removing the gap patterns and the lens seed layer on the gap patterns to form the lens seed patterns spaced apart from each other.",
    "10. The method according to claim 9, wherein forming the gap patterns on the inorganic layer comprises performing a photolithography process using a photomask having an opposite pattern to a photomask for the microlenses.",
    "11. The method according to claim 9, wherein forming the lens seed layer on the inorganic layer and the gap patterns comprises coating the lens seed layer to a thickness of about 10 nm to 1,000 nm.",
    "12. The method according to claim 9, further comprising, before the removing of the gap patterns and the lens seed layer on the gap patterns: developing the lens seed layer; and heat-treating the lens seed layer to cure the lens seed layer.",
    "13. The method according to claim 9, wherein removing the gap patterns and the lens seed layer on the gap patterns comprises using a solvent.",
    "14. The method according to claim 13, wherein the solvent comprises a mixture of propylene glycol monomethyl ether (PGME) and propylene glycol monomethyl ether acetate (PGMEA)",
    "15. The method according to claim 9, wherein the lens seed layer on the gap patterns is simultaneously removed with the gap patterns by the removal of the gap patterns.",
    "16. The method according to claim 8, wherein forming the inorganic layer comprises depositing a hydrophilic oxide layer.",
    "17. The method according to claim 8, wherein the lens seed patterns comprise a thermal resin."
  ],
  "cpc": [
    "H10F 39/8063",
    "H10F 39/024",
    "H10F 39/12"
  ],
  "assignees": [
    "YUN YOUNG JE"
  ],
  "filing_date": "2008-04-30",
  "publication_date": "2008-11-06",
  "priority_date": "2007-05-03",
  "application_number": "US-11275508-A",
  "family_id": "39938955",
  "citations": [
    "US2007276972A1",
    "US4694185A"
  ]
}