Targets and processes for fabricating same

{
  "publication_number": "US9895811B2",
  "country": "US",
  "kind": "B2",
  "title": "Targets and processes for fabricating same",
  "abstract": "In one embodiment, the present disclosure provides a target or mold having one or more support arms coupled to a substrate. The support arm can be used in handling or positioning a target. In another embodiment, the present disclosure provides target molds, targets produced using such molds, and a method for producing the targets and molds. In various implementations, the targets are formed in a number of disclosed shapes, including a funnel cone, a funnel cone having an extended neck, those having Gaussian-profile, a cup, a target having embedded metal slugs, metal dotted foils, wedges, metal stacks, a Winston collector having a hemispherical apex, and a Winston collector having an apex aperture. In yet another embodiment, the present disclosure provides a target mounting and alignment system.",
  "claims": [
    "1. A system, comprising: a rotatable mount situated to hold and rotate a target-wafer comprising a plurality of destructible laser targets situated to generate a proton emission in response to laser light from one or more laser sources; and an xyz stage coupled to the mount so as to translate the rotatable mount and the target-wafer; wherein the rotatable mount and xyz stage are situated to move the target-wafer relative to the laser light so as to generate the proton emission from the plurality of destructible laser targets.",
    "2. The system of claim 1, further comprising a manual control coupled to the rotatable mount and configured to control a rotation of the rotatable mount and the held target-wafer about an axis.",
    "3. The system of claim 2, further comprising a drive mechanism coupled to the manual control and the rotatable mount and configured to rotate the rotatable mount according to input received from the manual control.",
    "4. The system of claim 1, further comprising a manual control coupled to the xyz stage and configured to control a translation of the xyz stage.",
    "5. The system of claim 4, further comprising a drive mechanism coupled to the manual control and the xyz stage and configured to translate the xyz stage according to input received from the manual control.",
    "6. The system of claim 1, further comprising: a mount manual control coupled to the rotatable mount and configured to control a rotation of the rotatable mount about an axis; and a stage manual control coupled to the xyz stage and configured to control a translation of the xyz stage.",
    "7. The system of claim 6, further comprising: a mount drive mechanism coupled to the mount manual control and configured to rotate the rotatable mount about the axis; and a stage drive mechanism coupled to the stage manual control and configured to translate the xyz stage.",
    "8. The system of claim 1, further comprising a computer in communication with the rotatable mount and configured with software to cause the rotatable mount to rotate about an axis.",
    "9. The system of claim 8, further comprising a drive mechanism in communication with the computer and operatively coupled to the rotatable mount, the drive mechanism configured to rotate the rotatable mount about the axis according to instructions received from the computer.",
    "10. The system of claim 1, further comprising a computer in communication with the xyz stage and configured with software to cause the xyz stage to translate.",
    "11. The system of claim 10, further comprising a drive mechanism in communication with the computer and operatively coupled to the xyz stage, the drive mechanism configured to translate the xyz stage according to instructions received from the computer.",
    "12. The system of claim 1, further comprising a computer comprising software configured to: communicate with a drive mechanism associated with the rotatable mount that rotates the rotatable mount about an axis; and communicate with a drive mechanism associated with the xyz stage that translates the xyz stage.",
    "13. The system of claim 12, further comprising: a mount drive mechanism in communication with the computer and operatively coupled to the rotatable mount, the mount drive mechanism configured to rotate the rotatable mount about the axis according to instructions received from the computer; and a stage drive mechanism in communication with the computer and operatively coupled to the xyz stage, the stage drive mechanism configured to translate the xyz stage according to instructions received from the computer.",
    "14. The system of claim 1, further comprising a clip coupled to the mount and configured to selectively engage and retain the target-wafer.",
    "15. The system of claim 1, further comprising a plurality of clips coupled to the rotatable mount and configured to selectively engage and retain the target-wafer.",
    "16. The system of claim 1, wherein the plurality of destructible laser targets have the same shape.",
    "17. The system of claim 1, wherein the plurality of destructible laser targets have different shapes.",
    "18. The system of claim 1, further comprising the one or more laser sources situated to produce at least one laser beam corresponding to the laser light, wherein the rotatable mount and the xyz stage are configured to selectively place a selected portion of the target-wafer in the path of the at least one laser beam.",
    "19. The system of claim 18, wherein the selected portion is a selected one of the plurality of destructible laser targets on the target-wafer.",
    "20. The system of claim 18, wherein the rotatable mount and xyz stage are coupled to drive mechanisms located remotely from the target-wafer so as to reduce damage to the rotatable mount and xyz stage associated with the proton emission or laser light.",
    "21. The system of claim 1, further comprising the target-wafer comprising the plurality of laser targets."
  ],
  "description_excerpt": "The present disclosure relates to targets and their methods of fabrication. In particular examples, the present disclosure provide methods of fabricating metal targets useable as laser targets in high-energy laser-physics.\n\nMetal covered targets are typically used in high energy physics applications. For examples, such targets may be shot with a laser in order to generate plasmas or high energy radiation. Such targets may be used in applications such as inertial confinement fusion.\n\nLaser targets used to produce plasma and radiation typically have disadvantages. For example, such targets are typically manufactured individually and thus can be comparatively expensive. The expense of the targets may limit the number of targets available for use, thus potentially limiting how the targets can be used. For example, a limited number of targets available for a series of experiments may limit the quality or quantity of data obtained during the experiments.\n\nIn addition, laser targets typically require great care in handling and mounting, which can be time consuming and further limit how the targets may be used. For example, difficulties in mounting and handling targets can preclude uses that require rapid sequential target irradiation.\n\nThe comparatively large size of prior targets, and surface irregularities, may interfere with full characterization of the produced plasma. Excessive target material may also interfere with optimal energy production.\n\nSome prior experiments have used metal coated silicon targets. However, the silicon included in such targets typically interferes with energy focusing and radiation enhancement.",
  "cpc": [
    "B25J 11/00",
    "F16M 13/022",
    "H01J 40/16",
    "H05G 2/00",
    "H05H 1/46",
    "H05H 6/00",
    "Y10T 428/26",
    "Y10T 428/265",
    "Y10T 428/31678"
  ],
  "ipc": [
    "B25J 11/00",
    "F16M 13/02",
    "H01J 40/16",
    "H05G 2/00",
    "H05H 1/46",
    "H05H 6/00"
  ],
  "assignees": [
    "University of Nevada, Reno"
  ],
  "inventors": [
    "Steven Malekos",
    "Grant Korgan",
    "Jesse D. Adams"
  ],
  "filing_date": "2014-06-30",
  "publication_date": "2018-02-20",
  "grant_date": "2018-02-20",
  "priority_date": "2008-02-19",
  "application_number": "US-201414319592-A",
  "family_id": "40986179",
  "cited_by_count": 0,
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}