Patents full text · MLC-0201
CPC subclass C25D
Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US10272468B2 | Integrated fluidjet system for stripping, prepping and coating a part | 2019-04-30 | VLN ADVANCED TECH INC |
| 2 | US9476116B2 | Process for treating a plastic component part | 2016-10-25 | OERLIKON SURFACE SOLUTIONS AG TRUBBACH |
| 3 | US2013062197A1 | Plating cup with contoured cup bottom | 2013-03-14 | HE ZHIAN |
| 4 | US7022211B2 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | 2006-04-04 | EBARA CORP |
| 5 | US6391166B1 | Plating apparatus and method | 2002-05-21 | ACM RES INC |
| 6 | US6325138B1 | Article exhibiting improved resistance to galvanic corrosion | 2001-12-04 | CARRIER CORP |
| 7 | US6234678B1 | Plain bearing | 2001-05-22 | DAIDO METAL CO |
| 8 | US5571389A | Device for the electrochemical treatment especially the local electrochemical treatment, of conductive substrate | 1996-11-05 | DALIC |
8 records in this listing. Patents full text (MLC-0201). Request the full dataset.