Systems and methods for joining a first structure and a second structure with vacuum dispersion process

{
  "publication_number": "US12134235B2",
  "country": "US",
  "kind": "B2",
  "title": "Systems and methods for joining a first structure and a second structure with vacuum dispersion process",
  "abstract": "An example method of joining a first structure and a second structure is described that includes forming a bond cavity between a first structure and a second structure, placing a semi-permeable breather material at one or more exits of the bond cavity, placing a vacuum bag around the bond cavity and the semi-permeable breather material, evacuating the bond cavity via a vacuum port and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated, and curing the adhesive via one or more heaters to bond the first structure to the second structure.",
  "claims": [
    "1. A system for joining a first structure and a second structure, the system comprising: one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure; a semi-permeable breather material positioned at one or more exits of the bond cavity; a vacuum bag positioned around the bond cavity and the semi-permeable breather material; a vacuum port coupled to the vacuum bag for evacuating the bond cavity and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated; perforated adhesive tape positioned over the semi-permeable breather material to allow vacuum through and to block flow of the adhesive; and one or more heaters for curing the adhesive to bond the first structure to the second structure.",
    "2. The system of claim 1, further comprising: a fill sensor disposed at least partially in the semi-permeable breather material to detect that the adhesive fills the bond cavity.",
    "3. The system of claim 2, wherein the fill sensor includes a radio frequency identification (RFID) tag configured to modulate frequency response based on the adhesive contacting the RFID tag.",
    "4. The system of claim 2, wherein the fill sensor includes a piezo electric sensor configured to change a response as the adhesive moves toward the piezo electric sensor and based on the adhesive contacting the piezo electric sensor.",
    "5. The system of claim 2, wherein the fill sensor includes a capacitive sensor configured to respond to adjacent sealant.",
    "6. The system of claim 2, wherein the fill sensor includes a resistive sensor configured to respond to adhesive wetting and resultant resistivity changes by contact.",
    "7. The system of claim 2, wherein the fill sensor is disposed between the first structure and the second structure to maintain a width of the bond cavity.",
    "8. The system of claim 1, wherein the vacuum port is configured to force the adhesive into the bond cavity to fill the bond cavity with the adhesive such that the adhesive contacts the semi-permeable breather material.",
    "9. The system of claim 8, wherein the vacuum port is configured to discontinue evacuating the bond cavity via the vacuum port after filling the bond cavity.",
    "10. The system of claim 8, wherein the one or more heaters cure the adhesive after filling the bond cavity.",
    "11. The system of claim 1, wherein the first structure comprises a component of a wing of an aircraft and the second structure comprises a wing skin of the wing of the aircraft.",
    "12. The system of claim 1, wherein the semi-permeable breather material is a material selected from the group consisting of foam and rubber.",
    "13. The system of claim 1, wherein the vacuum port is configured to force de-aerated adhesive into the bond cavity.",
    "14. The system of claim 1, further comprising: an adhesive cartridge containing the adhesive inserted into the adhesive port, wherein the adhesive cartridge includes a dispenser to dispense the adhesive and a frangible seal proximal the dispenser; and while the bond cavity is evacuated, the vacuum port is configured to cause the frangible seal to break due to vacuum pressure and draw the adhesive into the bond cavity.",
    "15. The system of claim 1, wherein the one or more heaters are positioned adjacent to the bond cavity, and wherein the vacuum bag is positioned around the one or more heaters.",
    "16. The system of claim 1, further comprising: one or more spacers to maintain a width of the bond cavity.",
    "17. The system of claim 1, wherein the one or more heaters comprise a heat blanket positioned adjacent to the bond cavity.",
    "18. A system for joining a first structure and a second structure, the system comprising: one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure; a semi-permeable breather material positioned at one or more exits of the bond cavity; a vacuum bag positioned around the bond cavity and the semi-permeable breather material; a vacuum port coupled to the vacuum bag for evacuating the bond cavity and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated; a fill sensor disposed at least partially in the semi-permeable breather material to detect that the adhesive fills the bond cavity; and one or more heaters for curing the adhesive to bond the first structure to the second structure.",
    "19. The system of claim 18, wherein the fill sensor includes a radio frequency identification (RFID) tag configured to modulate frequency response based on the adhesive contacting the RFID tag.",
    "20. The system of claim 18, wherein the fill sensor includes a piezo electric sensor configured to change a response as the adhesive moves toward the piezo electric sensor and based on the adhesive contacting the piezo electric sensor."
  ],
  "description_excerpt": "The present disclosure relates generally to forming a bonded structure. In particular, the present disclosure relates to reducing voids in bondlines between a first structure and a second structure and forming a voidfree bondline.\n\nComponents used in vehicles, such as wings used in aircraft, include several bonded members. For example, exterior surfaces of a wing, and the structures used to provide support for those surfaces, may be constructed in a bonded manner using adhesives to create bondlines.\n\nCurrently, bonds for large or complex structures involve resin transfer molding, high tolerance film adhesive, or costly co-cure methods. Further, currently, paste bonds such as those that may be used in pi joints and single shear joints in aircraft, utilize adhesive injection approaches that can create bondlines between the bonded members that have some voids and variation in strength, and accordingly, may be rated with a lower performance capability.\n\nAs such, there is a desire for an improved bonding method to produce higher quality bonds in a low cost manner.\n\nIn an example, a method of joining a first structure and a second structure is described.",
  "cpc": [
    "B29C 65/544",
    "B29C 65/1448",
    "B29C 65/4835",
    "B29C 65/5057",
    "B29L 2031/3085",
    "F16B 11/006",
    "F16B 5/00"
  ],
  "ipc": [
    "B29C 65/14",
    "B29C 65/48",
    "B29C 65/50",
    "B29C 65/54",
    "B29L 31/30"
  ],
  "assignees": [
    "Boeing Co"
  ],
  "inventors": [
    "Joseph L. Hafenrichter",
    "Gary E. Georgeson"
  ],
  "filing_date": "2023-05-23",
  "publication_date": "2024-11-05",
  "grant_date": "2024-11-05",
  "priority_date": "2020-12-17",
  "application_number": "US-202318321874-A",
  "family_id": "82021991",
  "cited_by_count": 0,
  "citations": [
    "US3880331A",
    "US6270603B1",
    "US5833795A",
    "US20040050498A1",
    "US20070261787A1",
    "DE102010006328A1",
    "US20220194021A1"
  ]
}