MLchartDataset catalogue

Patents full text · MLC-0201

CPC subclass B24B

Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents

20 patents

Table 1. Patents
No.PublicationTitlePublishedAssignee
1US11897088B2Automated gemstone feeding2024-02-13Sahajanand Technologies Pvt Ltd
2US11396082B2Substrate holding device and substrate processing apparatus including the same2022-07-26Ebara Corp
3US10800697B2Glass-plate working apparatus2020-10-13Bando Kiko Co Ltd
4US10792779B2Method and apparatus for installing endless abrasive belt2020-10-06Flexmill Oy
5US2020138179A1Rotary Brush and Rotary Brush Wire Configurations2020-05-07Osborn LLC
6US10272661B2Pad removal device and method2019-04-30Taiwan Semiconductor Manufacturing Co TSMC Ltd
7US10213904B2Grinding wheel tool2019-02-26Mitsubishi Heavy Industries Machine Tool Co Ltd
8US9776297B2Mower reel grinding system using predetermined bracket positions2017-10-03Foley-Belsaw
9US9759872B1Optical fiber polishing fixture2017-09-12Domaille Engineering LLC
10US9475209B2Wire saw and workpiece machining method employing same2016-10-25Komatsu NTC Ltd
11US8506363B2Substrate holder and substrate holding method2013-08-13Ebara Corp
12US7530887B2Chemical mechanical polishing pad with controlled wetting2009-05-12Rohm and Haas Electronic Materials CMP Holdings Inc
13US7175504B2Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus2007-02-13Nikon Corp
14US6780773B2Method of chemical mechanical polishing with high throughput and low dishing2004-08-24Applied Materials Inc
15US6772784B1Proportional pressure regulator having positive and negative pressure delivery capability2004-08-10MAC Valves Inc
16US6460437B2Precision double-sided aspheric element2002-10-08Ophir Optronics Ltd
17US6135860AFixture for mechanical grinding and inspection of failed or defective semiconductor devices2000-10-24Sony Corp
18US5584746AMethod of polishing semiconductor wafers and apparatus therefor1996-12-17Shin Etsu Handotai Co Ltd
19US5085011AMethod and apparatus for mounting and faceting gemstones1992-02-04
20US5054243ABrake lining grinder apparatus and method1991-10-08General Motors Corp

20 records in this listing. Patents full text (MLC-0201). Request the full dataset.