Substrate holder and substrate holding method

{
  "publication_number": "US8506363B2",
  "country": "US",
  "kind": "B2",
  "title": "Substrate holder and substrate holding method",
  "abstract": "A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.",
  "claims": [
    "1. A substrate holder for holding a substrate by vacuum suction, said substrate holder comprising: a substrate-holding stage having a suction surface for the substrate; and a fluid passage selectively coupled to a vacuum source and a fluid supply source, wherein said suction surface has a plurality of closed sections surrounded by convexities, wherein said fluid passage includes a plurality of communication passages which are in fluid communication with said plurality of closed segments respectively and independently; said substrate-holding stage has a suction pad to be brought into contact with the substrate; and said convexities are formed by said suction pad.",
    "2. The substrate holder according to claim 1, wherein said substrate-holding stage includes a plurality of support members having a height equal to that of said convexities, and said plurality of support members are arranged in said plurality of closed sections.",
    "3. The substrate holder according to claim 1, wherein: said plurality of communication passages branch off from a single main passage; and flow-rate regulators for regulating a flow rate of fluid are provided in said plurality of communication passages.",
    "4. The substrate holder according to claim 3, wherein said flow-rate regulators are orifices that provide resistance to flow of the fluid.",
    "5. A substrate holder for holding a substrate by vacuum suction, said substrate holder comprising: a substrate-holding stage having a suction surface for the substrate; and a fluid passage selectively coupled to a vacuum source and a fluid supply source, wherein said suction surface has a plurality of closed sections surrounded by convexities, wherein said fluid passage includes a plurality of communication passages which are in fluid communication with said plurality of closed segments respectively and independently, wherein said substrate-holding stage has a sheet suction pad to be brought into contact with the substrate; and wherein said convexities and said closed sections are formed on a surface of said suction pad.",
    "6. The substrate holder according to claim 1, wherein said suction surface is smaller than the substrate.",
    "7. The substrate holder according to claim 5, wherein said substrate-holding stage includes a plurality of support members having a height equal to that of said convexities, and said plurality of support members are arranged in said plurality of closed sections.",
    "8. The substrate holder according to claim 5, wherein: said plurality of communication passages branch off from a single main passage; and flow-rate regulators for regulating a flow rate of fluid are provided in said plurality of communication passages.",
    "9. The substrate holder according to claim 8, wherein said flow-rate regulators are orifices that provide resistance to flow of the fluid.",
    "10. The substrate holder according to claim 5, wherein said suction surface is smaller than the substrate."
  ],
  "description_excerpt": "1. Field of the Invention\n\nThe present invention relates to a substrate holder and a substrate holding method for holding a thin plate-like substrate, such as a semiconductor wafer, by vacuum suction.\n\n2. Description of the Related Art\n\nA substrate holder which holds a surface of a substrate by vacuum suction is typically used as a device for holding a thin plate-like substrate, such as a semiconductor wafer, when processing the substrate. A conventional vacuum suction type substrate holder includes a single vacuum production hole, and holds the substrate by producing vacuum in a space between a suction member and the substrate. Further, the conventional substrate holder is configured to eject a high-pressure fluid from the vacuum production hole in order to release the substrate, which has been attracted once, from the substrate holder.\n\nFunctions required for the substrate holder include releasing the substrate without putting stress on the substrate, as well as holding the substrate sufficiently. In order to satisfy such requirements, various types of suction members and various shapes of suction surfaces of the substrate holder have been proposed. Especially, as a semiconductor wafer has a thickness of as thin as 1 mm or less and is made of brittle material, careful treatment is necessary so as not to damage the semiconductor wafer when releasing it.\n\nFIG. 1 is a cross-sectional view showing a conventional substrate holder, and FIG. 2 is a top plan view showing the substrate holder in FIG. 1 in a state of not holding the substrate.",
  "cpc": [
    "H10P 72/7626",
    "B23Q 3/088",
    "B24B 37/30",
    "B24B 41/068",
    "H10P 72/7614",
    "H10P 72/78"
  ],
  "ipc": [
    "B24B 41/06",
    "B23Q 3/08",
    "H01L 21/683",
    "B24B 29/02"
  ],
  "assignees": [
    "Ebara Corp"
  ],
  "inventors": [
    "Tamami Takahashi",
    "Hiroaki Kusa",
    "Masaya Seki"
  ],
  "filing_date": "2009-12-23",
  "publication_date": "2013-08-13",
  "grant_date": "2013-08-13",
  "priority_date": "2008-12-25",
  "application_number": "US-65456109-A",
  "family_id": "42572360",
  "cited_by_count": 6,
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}