System and method for moving workpieces between multiple vacuum environments

{
  "publication_number": "US9520312B2",
  "country": "US",
  "kind": "B2",
  "title": "System and method for moving workpieces between multiple vacuum environments",
  "abstract": "Provided are approaches for transferring workpieces between multiple pressure environments. In one approach, a system for moving workpieces between a first pressure environment and a second pressure environment includes a first vacuum enclosure, a second vacuum enclosure, and an access port disposed between the first vacuum enclosure and the second vacuum enclosure. The system further includes a transfer carrier having a workpiece holder for retaining a workpiece, the transfer carrier disposed within the first vacuum enclosure and moveable between a first process position and a second process position, wherein in the first process position the workpiece is disposed within the first vacuum enclosure, and wherein in the second process position the workpiece holder abuts the access port to expose the workpiece to the second vacuum enclosure and to create a seal around the access port to seal the first vacuum enclosure from the second vacuum enclosure.",
  "claims": [
    "1. A system for moving workpieces between a first pressure environment and a second pressure environment, the system comprising: a first vacuum enclosure; a second vacuum enclosure; an access port disposed between the first vacuum enclosure and the second vacuum enclosure; and a transfer carrier having a workpiece holder for retaining a workpiece, the transfer carrier disposed within the first vacuum enclosure and moveable between a first process position and a second process position, wherein in the second process position the workpiece holder abuts the access port to expose the workpiece to the second vacuum enclosure and to create a seal around the access port to seal the first vacuum enclosure from the second vacuum enclosure, wherein the workpiece holder is disposed entirely within the first vacuum enclosure in the first process position and in the second process position, and wherein the workpiece is disposed only within the access port when the transfer carrier is in the second process position.",
    "2. The system of claim 1, the access port comprising a valve configured to be in an open position when the transfer carrier is in the second process position and in a closed position when the transfer carrier is in the first process position.",
    "3. The system of claim 1, the first vacuum enclosure configured to be held at a first vacuum pressure level, the second vacuum enclosure configured to be held at a second vacuum pressure level, the first vacuum pressure level being different than the second vacuum pressure level.",
    "4. The system of claim 1, the first vacuum enclosure configured to be held at a first vacuum pressure level, the second vacuum enclosure configured to be held at a second vacuum pressure level, the first vacuum pressure level being substantially equal to the second vacuum pressure level.",
    "5. The system of claim 1, further comprising a set of annular protrusions in a sidewall of the first vacuum enclosure, the set of annular protrusions located along a perimeter of the access port.",
    "6. The system of claim 5, the workpiece holder comprising a set of annular grooves aligned to engage the set of annular protrusions.",
    "7. The system of claim 1, the workpiece holder further comprising an O-ring in contact with a sidewall of the first vacuum enclosure when the transfer carrier is in the second process position.",
    "8. The system of claim 1, further comprising a set of non-contact vacuum isolation pumping grooves along a perimeter of the access port.",
    "9. A transfer carrier for moving workpieces between a first pressure environment and a second pressure environment, the transfer carrier comprising: a workpiece holder for retaining a workpiece, the transfer carrier disposed within a first vacuum enclosure and moveable between a first process position and a second process position, wherein in the first process position the workpiece is disposed within the first vacuum enclosure, wherein in a second process position the workpiece holder abuts an inner surface of the first vacuum enclosure surrounding an access port disposed between the first vacuum enclosure and a second vacuum enclosure to regulate exposure of the workpiece to the second vacuum enclosure using a valve of the access port and to create a seal around the access port to seal the first vacuum enclosure from the second vacuum enclosure, wherein the workpiece holder is disposed entirely within the first vacuum enclosure in the first process position and in the second process position, and wherein the workpiece is disposed only within the access port when the transfer carrier is in the second process position.",
    "10. The transfer carrier of claim 9, wherein a sidewall of the first vacuum enclosure includes a set of annular protrusions located along a perimeter of the access port, and wherein a set of annular grooves in the workpiece holder are aligned to engage the set of annular protrusions when the transfer carrier is in the second process position.",
    "11. The transfer carrier of claim 9, the workpiece holder further comprising an O-ring in contact with a sidewall of the first vacuum enclosure when the transfer carrier is in the second process position.",
    "12. The transfer carrier of claim 9, wherein a sidewall of the first vacuum enclosure comprises a set of non-contact vacuum isolation pumping grooves along a perimeter of the access port.",
    "13. A method for moving workpieces between a first pressure environment and a second pressure environment, the method comprising: providing a first vacuum enclosure coupled to a second vacuum enclosure, the first vacuum enclosure having a first vacuum pressure level and the second vacuum enclosure having a second vacuum pressure level; performing a first process on a workpiece in the first vacuum enclosure, the workpiece retained in a first process position by a workpiece holder of a transfer carrier; moving the transfer carrier between the first process position within the first vacuum enclosure to a second process position in which the workpiece holder abuts an access port connecting the first vacuum enclosure and the second vacuum enclosure, wherein the workpiece holder is disposed entirely within the first vacuum enclosure in the first process position and in the second process position, and wherein the workpiece is disposed only within the access port when the transfer carrier is the second process position; creating a seal around the access port; opening the access port to expose the workpiece to an interior of the second vacuum enclosure; and performing a second process on the workpiece in the second vacuum enclosure.",
    "14. The method of claim 13, wherein the workpiece is continuously retained by the workpiece holder from a start of the first process until a completion of the second process.",
    "15. The method of claim 14, further comprising: closing the access port following the completion of the second process; moving the transfer carrier from the second process position to the first process position; and performing a third process on the workpiece in the first vacuum enclosure.",
    "16. The method of claim 13, wherein the first vacuum pressure level is higher than the second vacuum pressure level.",
    "17. The method of claim 13, wherein the first vacuum pressure level is substantially equal to the second vacuum pressure level.",
    "18. The method of claim 13, the creating the seal around the access port comprising engaging a set of annular protrusions in a sidewall of the first vacuum enclosure with a set of annular grooves in the workpiece holder.",
    "19. The method of claim 13, the creating the seal around the access port comprising contacting a sidewall of the first vacuum enclosure using an O-ring.",
    "20. The method of claim 13, the creating the seal around the access port comprising removing a fluid from a set of non-contact vacuum isolation pumping grooves positioned along a perimeter of the access port."
  ],
  "description_excerpt": "The disclosure relates generally to the field of semiconductor device fabrication, and more particularly to a device and method for moving semiconductor workpieces between multiple vacuum environments.\n\nIon implantation is a technique for introducing conductivity-altering impurities into semiconductor workpieces. During ion implantation, an intended impurity material is ionized in an ion source chamber, the ions are accelerated to form an ion beam of prescribed energy, and the ion beam is focused and directed toward the surface of a workpiece positioned in a vacuum enclosure. The energetic ions in the ion beam penetrate into the bulk of the workpiece material and are embedded into the crystalline lattice of the material to form a region of intended conductivity.\n\nSemiconductor work pieces are highly susceptible to particulate contamination that can detrimentally alter the conductivity characteristics of a workpiece. In order to mitigate such contamination, ion implantation is typically performed in high vacuum pressure environments. It is therefore beneficial to employ transfer devices for moving workpieces into and out of such vacuum environments in an expeditious manner, while simultaneously minimizing the creation and transmission of particulate matter.\n\nA typical architecture for dealing with two or more processes for a workpiece consists of a mainframe, which provides the mechanisms for handling the workpiece from one process environment to the other.",
  "cpc": [
    "H10P 72/3302",
    "H01L 21/67126",
    "H01L 21/67213",
    "H01L 21/67742",
    "H01L 21/67748",
    "H01L 21/68764",
    "H10P 72/0441",
    "H10P 72/0471",
    "H10P 72/3306",
    "H10P 72/7618"
  ],
  "ipc": [
    "B25J 11/00",
    "H10P 72/00",
    "H10P 72/10",
    "H10P 72/30",
    "H10P 72/76"
  ],
  "assignees": [
    "Varian Semiconductor Equipment Associates Inc"
  ],
  "inventors": [
    "James P. Buonodono"
  ],
  "filing_date": "2014-12-19",
  "publication_date": "2016-12-13",
  "grant_date": "2016-12-13",
  "priority_date": "2014-12-19",
  "application_number": "US-201414577187-A",
  "family_id": "56130294",
  "cited_by_count": 0,
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}