Motorized chamber lid

{
  "publication_number": "US6776848B2",
  "country": "US",
  "kind": "B2",
  "title": "Motorized chamber lid",
  "abstract": "A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.",
  "claims": [
    "1. A semiconductor processing chamber comprising: a chamber body having sidewalls and a bottom defining an interior volume; a lid assembly coupled to the chamber body and movable between a first position enclosing the interior volume and a second position; a hinge assembly coupled between the lid assembly and the chamber body, wherein the hinge assembly further comprises: one or more mounting brackets coupled to the lid assembly; a shaft coupled to the mounting brackets and coplanar with the upper surface of the chamber body; and one or more bearing mounts rotatably coupled to the shaft; and a motor coupled to the hinge assembly for moving the lid assembly between at least the first position and the second position.",
    "2. The semiconductor processing chamber of claim 1, wherein the bearing mounts are coupled to the chamber body, a frame circumscribing the chamber body or a processing platform having the chamber body coupled thereto.",
    "3. The semiconductor processing chamber of claim 1, wherein the lid assembly further comprises a target and a magnetron.",
    "4. A semiconductor processing chamber comprising: a chamber body having sidewalls and a bottom defining an interior volume; a lid assembly coupled to the chamber body and movable between a first position enclosing the interior volume and a second position; a hinge assembly coupled between the lid assembly and the chamber body; a motor coupled to the hinge assembly for moving the lid assembly between at least the first position and the second position; a plurality of first locating devices disposed between the lid assembly and the chamber body disposed proximate a shaft of the hinge assembly; and a plurality of second locating devices disposed between the lid assembly and the chamber body, the second locating devices disposed outward of the first locating devices relative the shaft.",
    "5. The semiconductor processing chamber of claim 4, wherein each of the first locating devices further comprises: a pin and a bushing having a “C” shaped cross section.",
    "6. The semiconductor processing chamber of claim 5, wherein each of the second locating devices further comprises: a pin and a cylindrical bushing.",
    "7. The semiconductor processing chamber of claim 5, wherein the pin is coupled to the lid assembly.",
    "8. A semiconductor processing chamber comprising: a chamber body having sidewalls and a bottom defining an interior volume; a lid coupled to the chamber body and having a bottom movable between a first position enclosing the interior volume and a second position; a target coupled to the bottom of the lid; a first mounting bracket coupled to the lid assembly; a shaft coupled to the first mounting bracket; one or more bearing mounts rotatably coupled to the shaft; a motor coupled to at least one of the shaft or first mounting bracket for moving the lid assembly between at least the first position and the second position; a first bushing having a “C” shaped cross section disposed in the chamber body; a first pin disposed between the lid assembly and the chamber body wherein a portion of the first pin mates with the first bushing; a second bushing having a cylindrical cross section disposed in the chamber body outward of the first bushing relative to the shaft; and a second pin disposed between the lid assembly and the chamber body wherein a portion of the second pin mates with the second bushing.",
    "9. The semiconductor processing chamber of claim 8, wherein the shaft is coplanar with the upper surface of the chamber body.",
    "10. The semiconductor processing chamber of claim 8, further comprising: a second mounting bracket coupled to the lid assembly and the shaft; and a brace coupled between the first and second mounting brackets.",
    "11. A physical vapor deposition chamber comprising: a chamber body having sidewalls and a bottom defining an interior volume; a lid coupled to the chamber body and having a bottom movable between a first position enclosing the interior volume and a second position; a target coupled to the bottom of the lid; one or more mounting brackets coupled to the lid assembly; a shaft fixed to the mounting brackets; one or more bearing mounts disposed on the chamber body and rotatably coupled to the shaft; a motor coupled to at least one of the shaft or mounting brackets for moving the lid assembly between at least the first position and the second position; a first bushing having a “C” shaped cross section disposed in the chamber body; a first pin disposed between the lid assembly and the chamber body wherein a portion of the first pin mates with the first bushing; a second bushing having a cylindrical cross section disposed in the chamber body outward of the first bushing relative to the shaft; and a second pin disposed between the lid assembly and the chamber body wherein a portion of the second pin mates with the second bushing.",
    "12. The semiconductor processing chamber of claim 1, wherein the motor is coupled to the shaft.",
    "13. The semiconductor processing chamber of claim 1 further comprising: a plurality of first locating devices disposed between the lid assembly and the chamber body disposed proximate a shaft of the hinge assembly; and a plurality of second locating devices disposed between the lid assembly and the chamber body, the second locating devices disposed outward of the first locating devices relative the shaft.",
    "14. The semiconductor processing chamber of claim 13, wherein each of the first locating devices further comprises: a pin and a bushing having a “C” shaped cross section.",
    "15. The semiconductor processing chamber of claim 14, wherein each of the second locating devices further comprises: a pin and a cylindrical bushing.",
    "16. The semiconductor processing chamber of claim 14, wherein the pin is coupled to the lid assembly.",
    "17. The semiconductor processing chamber of claim 4, wherein the hinge assembly further comprises: one or more mounting brackets coupled to the lid assembly; a shaft coupled to the mounting brackets; and one or more bearing mounts rotatably coupled to the shaft.",
    "18. The semiconductor processing chamber of claim 17, wherein the motor is coupled to the shaft.",
    "19. The semiconductor processing chamber of claim 17, wherein the bearing mounts are coupled to the chamber body, a frame circumscribing the chamber body or a processing platform having the chamber body coupled thereto.",
    "20. The semiconductor processing chamber of claim 4, wherein the lid assembly further comprises a target and a magnetron.",
    "21. The semiconductor processing chamber of claim 8, further comprising: a first bushing having a “C” shaped cross section disposed in the chamber body; and a first pin disposed between the lid assembly and the chamber body wherein a portion of the first pin mates with the first bushing."
  ],
  "cpc": [
    "H01J 37/32458",
    "C23C 14/35",
    "C23C 16/44",
    "E05F 15/614",
    "E05F 15/622",
    "E05Y 2900/00",
    "E05Y 2999/00"
  ],
  "assignees": [
    "APPLIED MATERIALS INC"
  ],
  "filing_date": "2002-01-17",
  "publication_date": "2004-08-17",
  "grant_date": "2004-08-17",
  "priority_date": "2002-01-17",
  "application_number": "US-5329602-A",
  "family_id": "21983226",
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}