Apparatus and methods for reticle handling in an EUV reticle inspection tool

{
  "publication_number": "US9851643B2",
  "country": "US",
  "kind": "B2",
  "title": "Apparatus and methods for reticle handling in an EUV reticle inspection tool",
  "abstract": "Systems and methods to control particle generation in a reticle inspection system are presented. The number of particles added to a reticle during an entire load-inspect-unload sequence of a reticle inspection system is reduced by performing all reticle contact events in a controlled, flowing air environment. In one embodiment, the reticle is fixed to a carrier by clamping outside of the vacuum environment, and the carrier, rather than the reticle, is coupled to the reticle stage of the inspection system. In this manner, the high levels of back-side particulation associated with electrostatic chucking are avoided. In addition, the carrier is configured to be coupled to the reticle stage in any of four different orientations separated by ninety degrees.",
  "claims": [
    "1. A method of handling a reticle in a reticle inspection system comprising: opening an EUV Inner Pod (EIP) in a clean, dry air environment with flow control by separating an EIP base from an EIP cover of the EIP; locating a reticle carrier over the reticle, wherein the reticle carrier is stored in the reticle inspection system; clamping the reticle to the reticle carrier, wherein the clamping involves a movement of a plurality of reticle clamping elements relative to the reticle carrier from a disengaged position to an engaged position that grasps the reticle and clamps the reticle to the reticle carrier; pumping down a chamber that includes the reticle carrier and the reticle; and locating the reticle carrier onto a reticle stage leaving a patterned surface of the reticle exposed for inspection, wherein the reticle carrier is attached to the reticle stage by a kinematic mount in any of four different orientations separated by ninety degrees.",
    "2. The method of claim 1, further comprising: locating a reticle carrier base under the reticle, the reticle carrier base including features to transport the reticle in any of four different orientations separated by ninety degrees, wherein the reticle carrier base is stored in the reticle inspection system.",
    "3. The method of claim 2, further comprising: coupling the reticle carrier base to the reticle carrier in atmosphere, wherein the reticle face does not touch the reticle carrier base; and decoupling the carrier base from the carrier in vacuum.",
    "4. The method of claim 1, further comprising: measuring an orientation of the reticle with respect to the reticle carrier; and reorienting the reticle with respect to the reticle carrier based at least in part on the measured orientation.",
    "5. The method of claim 1, further comprising: locating the EIP base under the reticle; coupling the EIP base to the reticle carrier in atmosphere, wherein the EIP base does not contact a face of the reticle; and decoupling the EIP base from the reticle carrier in vacuum.",
    "6. The method of claim 5, further comprising: locating an EIP base adapter plate under the EIP base, wherein the EIP base adapter plate includes a plurality of features that enable the reticle to be transported in any of four different orientations separated by 90 degrees.",
    "7. The method of claim 1, further comprising: clamping the reticle carrier to the reticle stage.",
    "8. The method of claim 1, further comprising: performing a particle inspection of a backside of the reticle after separating the EIP base from the EIP cover.",
    "9. A reticle inspection system comprising: an EUV inner pod disposed in the reticle inspection system, the EUV inner pod storing a reticle; a reticle carrier stored in a clean, dry environment in the reticle inspection system, the reticle carrier comprising: a plurality of reticle clamping elements; a plurality of actuators configured to move the plurality of reticle clamping elements relative to the reticle carrier from a disengaged position to an engaged position that grasps the reticle and clamps the reticle to the reticle carrier outside of a clean vacuum environment of the reticle inspection system when the reticle carrier is located over the reticle; and a set of kinematic mounting elements configured to kinematically couple the reticle carrier to a reticle stage of the reticle inspection system in any of four different orientations separated by ninety degrees in a clean vacuum environment, leaving a patterned surface of the reticle directly exposed for inspection.",
    "10. The reticle inspection system of claim 9, further comprising: a reticle carrier base stored in the reticle inspection system, wherein the reticle carrier base is configured to couple to the reticle carrier beneath and spaced apart from the reticle clamped to the reticle carrier.",
    "11. The reticle inspection system of claim 10, wherein the reticle carrier base includes a set of features to transport the reticle in any of four different orientations separated by ninety degrees.",
    "12. The reticle inspection system of claim 9, further comprising: a particle inspection system configured to inspect a backside of the reticle for backside particle contamination.",
    "13. The reticle inspection system of claim 9, further comprising: a transfer chamber including a transfer chamber storage pod configured to reorient a reticle carrier in any of four different orientations separated by ninety degrees.",
    "14. A method of handling a reticle in a reticle inspection system comprising: coupling a reticle carrier base to a reticle carrier that is kinematically mounted to a reticle stage in a clean vacuum environment of the reticle inspection system, wherein the reticle carrier base covers and is spaced apart from a patterned surface of the reticle that is clamped to the reticle carrier, and wherein the reticle carrier includes a set of features configured to kinematically couple to the reticle stage in any of four different orientations separated by ninety degrees; moving the reticle carrier and the reticle carrier base from the clean vacuum environment to a clean, dry air environment of the reticle inspection system; decoupling the reticle carrier base from the reticle carrier in the clean, dry air environment; and unclamping the reticle from the reticle carrier in the clean, dry air environment, wherein the unclamping involves a movement of a plurality of reticle clamping elements relative to the reticle carrier from an engaged position to a disengaged position that unclamps the reticle from the reticle carrier.",
    "15. The method of handling a reticle in a reticle inspection system of claim 14, wherein the reticle carrier and the reticle carrier base are stored in the clean, dry air environment of the reticle inspection system.",
    "16. The method of handling a reticle in a reticle inspection system of claim 14, further comprising: locating an EUV Inner Pod (EIP) base under the reticle; and coupling the EIP base to the reticle.",
    "17. The method of handling a reticle in a reticle inspection system of claim 16, further comprising: locating an EIP cover over the reticle and EIP base; and coupling the EIP base to the EIP cover."
  ],
  "description_excerpt": "The described embodiments relate to systems for specimen handling, and more particularly to particle management and specimen positioning in atmospheric and vacuum environments.\n\nSemiconductor devices such as logic and memory devices are typically fabricated by a sequence of processing steps applied to a specimen. The various features and multiple structural levels of the semiconductor devices are formed by these processing steps. For example, lithography, among others, is one semiconductor fabrication process that involves generating a pattern on a semiconductor wafer. Additional examples of semiconductor fabrication processes include, but are not limited to, chemical-mechanical polishing, etch, deposition, and ion implantation. Multiple semiconductor devices may be fabricated on a single semiconductor wafer and then separated into individual semiconductor devices.\n\nA lithographic process, as described above, is performed to selectively remove portions of a resist material overlaying the surface of a wafer, thereby exposing underlying areas of the specimen on which the resist is formed for selective processing such as etching, material deposition, implantation, and the like. Therefore, in many instances, the performance of the lithography process largely determines the characteristics (e.g., dimensions) of the structures formed on the specimen. Consequently, the trend in lithography is to design systems and components (e.g., resist materials) that are capable of forming patterns having ever smaller dimensions.",
  "cpc": [
    "G03F 7/70691",
    "B25J 11/0095",
    "G03F 1/84",
    "G03F 7/70741"
  ],
  "ipc": [
    "B25J 11/00",
    "G03F 1/84",
    "G03F 7/20"
  ],
  "assignees": [
    "KLA Tencor Corp"
  ],
  "inventors": [
    "Francis Charles Chilese",
    "Ulrich Pohlmann",
    "Detlef Wolter",
    "Joseph Fleming Walsh"
  ],
  "filing_date": "2013-03-08",
  "publication_date": "2017-12-26",
  "grant_date": "2017-12-26",
  "priority_date": "2012-03-27",
  "application_number": "US-201313791470-A",
  "family_id": "49233095",
  "cited_by_count": 5,
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}