Shear-layer chuck for lithographic apparatus

{
  "publication_number": "US8976336B2",
  "country": "US",
  "kind": "B2",
  "title": "Shear-layer chuck for lithographic apparatus",
  "abstract": "A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.",
  "claims": [
    "1. A system for supporting an object, comprising: a chuck having a first surface that supports the object; a stage that supports the chuck in one or more directions of translation or rotation; and an interface layer comprising an array of elongated elements extending from a surface of the interface layer, the interface layer being disposed between the chuck and the stage with a relatively low stiffness in at least one direction of translation or rotation with respect to the other directions of translation or rotation, resulting in minimization of slippage of the object relative to the first surface of the chuck during deformation of the chuck due to a stress between the stage and the chuck.",
    "2. The system of claim 1, wherein the stress arises from acceleration of the stage.",
    "3. The system of claim 1, wherein the stress arises due to a relative temperature difference between the object, the chuck, and the stage.",
    "4. The system of claim 1, wherein at least one of an acceleration of the stage and a relative temperature difference between the object, the chuck, and the stage is configured to produce the stress.",
    "5. The system of claim 1, wherein the array of elongated elements are arranged to distribute the stress uniformly.",
    "6. The system of claim 1, wherein the array of elongated elements extend orthogonally from the surface of the interface layer.",
    "7. A lithographic apparatus, comprising: an illumination system configured to condition a radiation beam; a support configured to support a patterning device, the patterning device being configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a projection system configured to project the patterned radiation beam onto a target portion of a substrate; and a substrate table configured to support the substrate, wherein at least one of the support and the substrate table includes: a chuck having a first surface that supports the patterning device or the substrate, a stage that supports the chuck in one or more directions of translation or rotation, and an interface layer comprising an array of elongated elements extending from a surface of the interface layer, the interface layer being disposed between the chuck and the stage with a relatively low stiffness in at least one direction of translation or rotation with respect to the other directions of translation or rotation, resulting in minimization of slippage of the patterning device or the substrate relative to the first surface of the chuck during deformation of the chuck due to a stress between the stage and the chuck.",
    "8. The lithographic apparatus of claim 7, wherein the stress arises from acceleration of the stage.",
    "9. The lithographic apparatus of claim 7, wherein the stress arises due to a relative temperature difference between the patterning device or the substrate, the chuck, and the stage.",
    "10. The lithographic apparatus of claim 7, wherein at one of an acceleration of the stage and a relative temperature difference between the patterning device or the substrate, the chuck, and the stage is configured to produce the stress.",
    "11. The lithographic apparatus of claim 7, wherein the array of elongated elements are arranged to distribute the stress uniformly.",
    "12. The lithographic apparatus of claim 7, wherein the array of elongated elements extend orthogonally from the surface of the interface layer."
  ],
  "description_excerpt": "1. Field of the Invention\n\nThe present invention relates to a lithographic apparatus and method of securely holding an object in the lithographic apparatus.\n\n2. Related Art\n\nA lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that instance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g., comprising part of, one, or several dies) on a substrate (e.g., a silicon wafer). Transfer of the pattern is typically via imaging the pattern using a UV radiation beam onto a layer of radiation-sensitive material (resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at one time, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the “scanning” direction) while synchronously scanning the substrate parallel or anti-parallel to this direction. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.",
  "cpc": [
    "G03F 7/70716",
    "G03F 7/707",
    "G03F 7/70783",
    "H01L 21/683",
    "H01L 21/68714",
    "H01L 21/6875",
    "H10P 72/70",
    "H10P 72/7604",
    "H10P 72/7614",
    "H10P 76/2042",
    "Y10S 414/141",
    "Y10T 279/34"
  ],
  "ipc": [
    "G03F 7/20",
    "H10P 72/50",
    "H10P 72/76"
  ],
  "assignees": [
    "ASML Holding NV"
  ],
  "inventors": [
    "Samir A. Nayfeh",
    "Mark Edd Williams",
    "Justin Matthew Verdirame"
  ],
  "filing_date": "2014-04-23",
  "publication_date": "2015-03-10",
  "grant_date": "2015-03-10",
  "priority_date": "2008-04-10",
  "application_number": "US-201414259723-A",
  "family_id": "40752516",
  "cited_by_count": 2,
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}