Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder

{
  "publication_number": "US9423699B2",
  "country": "US",
  "kind": "B2",
  "title": "Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder",
  "abstract": "A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.",
  "claims": [
    "1. A substrate holder for use in a lithographic apparatus, the substrate holder comprising: a main body having a surface; a plurality of burls projecting from the surface and having end surfaces; a planarization layer provided on at least part of the surface of the main body; and a heater and/or a sensor provided on the planarization layer.",
    "2. The substrate holder according to claim 1, wherein the planarization layer has a surface roughness Ra less than about 1.5 μm.",
    "3. The substrate holder according to claim 1, wherein the planarization layer is formed of a silicon-based material.",
    "4. The substrate holder according to claim 3, wherein the planarization layer is formed of a silicon oxide or silicon nitride based material.",
    "5. The substrate holder according to claim 3, wherein the planarization layer includes a functional group selected from the group consisting of: hydrogen, methyl, fluoro, and vinyl.",
    "6. The substrate holder according to claim 1, wherein the planarization layer is formed of a carbon-based material.",
    "7. The substrate holder according to claim 1, wherein the planarization layer is formed of benzocyclobutene.",
    "8. The substrate holder according to claim 1, wherein the main body is formed of a material selected from the group consisting of: SiC (silicon carbide), SiSiC (siliconised silicon carbide), Si 3 N 4 (silicon nitrite), quartz, and Zerodur™ glass ceramic.",
    "9. The substrate holder according to claim 1, wherein the planarization layer is formed of a plurality of separately formed sub-layers.",
    "10. The substrate holder according to claim 1, wherein the planarization layer has a thickness in the range of from about 0.2 μm to about 200 μm.",
    "11. The substrate holder according to claim 1, wherein the planarization layer does not cover at least the end surfaces of the burls.",
    "12. The substrate holder according to claim 11, wherein the burls have side surfaces and the planarization layer does not cover at least part of the side surfaces of the burls.",
    "13. The substrate holder according to claim 1, wherein the heater and/or sensor is a thin-film component.",
    "14. A lithographic apparatus, comprising: a support structure configured to support a patterning device; a projection system arranged to project a beam patterned by the patterning device onto a substrate; and a substrate holder arranged to hold the substrate, the substrate holder comprising: a main body having a surface, a plurality of burls projecting from the surface and having end surfaces, a planarization layer provided on at least part of the surface of the main body, and a heater and/or a sensor provided on the planarization layer.",
    "15. The lithographic apparatus according to claim 14, wherein the planarization layer is formed of a silicon-based material.",
    "16. The lithographic apparatus according to claim 14, wherein the planarization layer is formed of benzocyclobutene.",
    "17. A device manufacturing method using a lithographic apparatus, the method comprising: projecting a beam of radiation onto a substrate; whilst holding the substrate in a substrate holder; wherein the substrate holder comprises: a main body having a surface; a plurality of burls projecting from the surface and having end surfaces; a planarization layer provided on at least part of the surface of the main body; and a heater and/or a sensor provided on the planarization layer.",
    "18. A method of manufacturing a substrate holder for use in a lithographic apparatus, the method comprising: providing a main body having a surface and a plurality of burls projecting from the surface and having end surfaces; and forming a planarization layer on at least part of the surface of the main body, wherein the planarization layer is formed of a plurality of separately formed sub-layers; and providing an electronic component that overlies the sub-layers.",
    "19. A substrate holder for use in a lithographic apparatus, the substrate holder comprising: a main body having a surface; a plurality of burls projecting from the surface and having end surfaces; and a planarization layer provided on at least part of the surface of the main body to cover an area encompassing the plurality of burls, the planarization layer provided between the burls but not covering the end surfaces of the plurality of burls, and the planarization layer comprising a first surface and a second surface opposite the first surface, wherein the first surface of the planarization layer fills in roughness of the surface of the main body between the burls and the surface roughness Ra of the second surface is less than the surface roughness Ra of the first surface.",
    "20. The substrate holder of claim 19, further comprising an electronic component overlying the second surface."
  ],
  "description_excerpt": "This application claims priority and benefit under 35 U.S.C. §119(e) to U.S. Provisional Patent Application No. 61/422,918, filed on Dec. 14, 2010. The content of that application is incorporated herein in its entirety by reference.\n\nThe present invention relates to a substrate holder, a lithographic apparatus, a device manufacturing method, and a method of manufacturing a substrate holder.\n\nA lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that instance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g. comprising part of, one, or several dies) on a substrate (e.g. a silicon wafer). Transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at one time, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the “scanning”-direction) while synchronously scanning the substrate parallel or anti-parallel to this direction.",
  "cpc": [
    "G03F 7/70341",
    "C23C 16/44",
    "G03F 7/707",
    "G03F 7/70716",
    "G03F 7/70975",
    "H10P 72/7614",
    "Y10T 29/49"
  ],
  "ipc": [
    "B23P 17/00",
    "G03B 27/58",
    "H10P 72/76",
    "G03B 27/42",
    "G03F 7/20"
  ],
  "assignees": [
    "ASML Netherlands BV"
  ],
  "inventors": [
    "Raymond Wilhelmus Louis Lafarre",
    "Nicolaas Ten Kate",
    "Nina Vladimirovna DZIOMKINA",
    "Yogesh Pramod KARADE"
  ],
  "filing_date": "2011-12-12",
  "publication_date": "2016-08-23",
  "grant_date": "2016-08-23",
  "priority_date": "2010-12-14",
  "application_number": "US-201113323520-A",
  "family_id": "46199076",
  "cited_by_count": 7,
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