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Patent · US5156727A · A · US

Film thickness uniformity control apparatus for in-line sputtering systems

(11) Publication number
US5156727A
(21) Application number
07/596,853
(22) Filing date
1990-10-12
(30) Priority date
1990-10-12
(43) Publication date
1992-10-20
(45) Date of grant
1992-10-20
(51) IPC
C23C 14/04; H01J 37/34
(52) CPC
  • H01J Electric discharge tubes or discharge lamps: 37/32623, 37/34
  • C23C Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general: 14/044
(73) Assignee
Viratec Thin Films Inc
(72) Inventors
Erik J. Bjornard; Michael J. Valiska; Clifford L. Taylor
(54) Title
Film thickness uniformity control apparatus for in-line sputtering systems
(57) Abstract

A mask arrangement is located between the cathode and substrate in an in-line sputtering system. The relative shape of the mask may be changed from outside the system. Thus, film thickness uniformity can be modified and controlled without interrupting the sputtering process.

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Claims (20)

  1. Apparatus for use in an in-line sputtering system, comprising: at least two plates each having front and back edges, positioned between a target and a substrate for receiving sputtered material and first and second ends; said plates being pivotally joinable at said first ends such that said front edges of said plates may be moved relative to each other; and means for pivoting said plates to move said front edges relative to each other to adjust the shape of said mask. While said mask is positioned between said target and said substrate so that a portion of said sputtered material is prevented from reaching said substrate.
  2. The apparatus of claim 1 wherein said pivoting means includes a bell-crank at said first end and at said back edge of each of said plates.
  3. The apparatus of claim 2 wherein said pivoting means further includes an extendable arm pivotally attachable at one end thereof to said bell-crank and at a second end thereof to a means for rotating said extendable arm to change the length thereof.
  4. The apparatus of claim 3 wherein said rotating means includes a shaft for extending through a wall of a vacuum coating chamber; a vacuum seal for rotatably sealing said shaft to the wall of the coating chamber; and means for attaching said shaft to said extendable arm to couple rotary motion thereto.
  5. The apparatus of claim 2 wherein said pivoting means includes a first shaft pivotally attachable to said bell-crank, and means for moving said first shaft along its longitudinal axis.
  6. The apparatus of claim 5 wherein said first shaft moving means includes a second shaft extendable through a wall of a vacuum coating chamber; a vacuum seal for sealing said second shaft to the wall of the coating chamber; and means for attaching said first shaft to said second shaft to permit movement of said first shaft along its longitudinal axis.
  7. Apparatus for depositing a coating on a substrate, comprising: an in-line coating machine including at least one vacuum coating chamber, at least one sputtering cathode mounted in said chamber, and means for transporting the substrate past said cathode for receiving sputtered material; at least one mask including at least two movable plates, said mask mounted in said chamber at a position between said sputtering cathode and said substrate so that a portion of said sputtered material may be prevented from reaching said substrate depending upon the relative position of said plates; and means for moving said plates to change the relative position thereof.
  8. The apparatus of claim 7 wherein said plates each have front and back edges, and first and second ends; said plates being pivotally joined at said first ends such that said front edges of said plates may be moved relative to each other.
  9. The apparatus of claim 8 wherein said moving means includes a bell-crank at said first end and at said back edge of each of said plates.
  10. The apparatus of claim 9 wherein said moving means further includes an extendable arm having a first shaft with a threaded end and a second shaft rotatably attached to said first shaft with a mating thread, said first shaft being pivotally attached at one end thereof to said bell-crank, and said second shaft rotatably attached to a means for rotating said extendable arm to adjust the length thereof.
  11. The apparatus of claim 10 wherein said rotating means includes a third shaft extending through a wall of the coating chamber; a vacuum seal for rotatably sealing said third shaft to the wall of the coating chamber; and means for rotatably attaching said third shaft to said second shaft.
  12. The apparatus of claim 7 wherein said plates are movably supported at said second ends.
  13. The apparatus of claim 7 wherein said mask further includes a fixed plate to which said two movable plates are attached.
  14. The apparatus of claim 7, wherein said mask includes 4 movable plates.
  15. Apparatus for depositing a coating on a substrate by sputtering, comprising: an in-line coating machine including at least one vacuum coating chamber, at least one sputtering cathode mounted in said chamber, and means for transporting the substrate past said sputtering cathode for receiving sputtered material; at least one mask including at least two plates mounted at a position between said cathode and said substrate, each of said plates having front and back edges, and first and second ends, and said plates being pivotally joined at said first ends so that said front edges of said plates may be moved relative to each other; means for mounting said plates in said chamber; and means for pivoting said plates relative to each other.
  16. The apparatus of claim 15 wherein said mounting means includes a center pivot bracket supporting said plates at said first ends, and two end supports movably supporting said plates at said second ends.
  17. The apparatus of claim 16 wherein said pivoting means includes a bell-crank at said first end and at said back edge of each of said plates.
  18. The apparatus of claim 17 wherein said pivoting means further includes an extendable arm pivotally attached at one end thereof to said bell-crank and at a second end thereof to a means for rotating said extendable arm to adjust the length thereof.
  19. The apparatus of claim 18 wherein said rotary means includes a shaft extending through a wall of a coating chamber; a vacuum seal for rotatably sealing said shaft to the wall of the coating chamber; and means for attaching said shaft to said extendable arm to couple rotary motion thereto.
  20. The apparatus of claim 19 wherein said attaching means includes universal joints.

Description

The present invention relates generally to apparatus for sputter deposition of optical coatings, and more particularly to continuous in-line sputtering apparatus for controlling the uniformity of the deposited layers.

Reactive sputtering is the process most often used for large area commercial coating applications. Typical applications are thermal control coatings for architectural and automobile glazings. In this process, the articles to be coated are passed through a series of in-line vacuum chambers isolated from one another by vacuum locks. Such an apparatus is referred to as an in-line system or a glass coater. Inside the vacuum chambers, a gas discharge, the sputtering discharge, is maintained. The sputtering discharge pressure is held between about 1 to 5 millitorr, by constantly admitting a mixture of an inert gas, such as argon, with a small proportion of a reactive gas, for example oxygen, for the formation of oxides. Each chamber contains one or more cathodes held at a negative potential in the range from about -200 to -1000 volts. The cathodes may be in the form of elongated rectangles, the length of which spans the width of the chambers. The cathodes are typically 0.10 to 0.30 meters wide and a meter or greater in length. The cathodes are surfaced with a metal with which the reactive gas will form the appropriate compound. This metal surface is frequently referred to as the sputtering target. The cathodes include a magnet array which concentrates the sputtering activity in a narrow region on the target called the sputtering zone. This type of cathode is known as a magnetron cathode.

Citations (6)

  • US3661759A
  • US4278528A
  • US4294678A
  • US4315960A
  • US4562093A
  • US4814056A
Record as JSON
{
  "publication_number": "US5156727A",
  "country": "US",
  "kind": "A",
  "title": "Film thickness uniformity control apparatus for in-line sputtering systems",
  "abstract": "A mask arrangement is located between the cathode and substrate in an in-line sputtering system. The relative shape of the mask may be changed from outside the system. Thus, film thickness uniformity can be modified and controlled without interrupting the sputtering process.",
  "claims": [
    "1. Apparatus for use in an in-line sputtering system, comprising: at least two plates each having front and back edges, positioned between a target and a substrate for receiving sputtered material and first and second ends; said plates being pivotally joinable at said first ends such that said front edges of said plates may be moved relative to each other; and means for pivoting said plates to move said front edges relative to each other to adjust the shape of said mask. While said mask is positioned between said target and said substrate so that a portion of said sputtered material is prevented from reaching said substrate.",
    "2. The apparatus of claim 1 wherein said pivoting means includes a bell-crank at said first end and at said back edge of each of said plates.",
    "3. The apparatus of claim 2 wherein said pivoting means further includes an extendable arm pivotally attachable at one end thereof to said bell-crank and at a second end thereof to a means for rotating said extendable arm to change the length thereof.",
    "4. The apparatus of claim 3 wherein said rotating means includes a shaft for extending through a wall of a vacuum coating chamber; a vacuum seal for rotatably sealing said shaft to the wall of the coating chamber; and means for attaching said shaft to said extendable arm to couple rotary motion thereto.",
    "5. The apparatus of claim 2 wherein said pivoting means includes a first shaft pivotally attachable to said bell-crank, and means for moving said first shaft along its longitudinal axis.",
    "6. The apparatus of claim 5 wherein said first shaft moving means includes a second shaft extendable through a wall of a vacuum coating chamber; a vacuum seal for sealing said second shaft to the wall of the coating chamber; and means for attaching said first shaft to said second shaft to permit movement of said first shaft along its longitudinal axis.",
    "7. Apparatus for depositing a coating on a substrate, comprising: an in-line coating machine including at least one vacuum coating chamber, at least one sputtering cathode mounted in said chamber, and means for transporting the substrate past said cathode for receiving sputtered material; at least one mask including at least two movable plates, said mask mounted in said chamber at a position between said sputtering cathode and said substrate so that a portion of said sputtered material may be prevented from reaching said substrate depending upon the relative position of said plates; and means for moving said plates to change the relative position thereof.",
    "8. The apparatus of claim 7 wherein said plates each have front and back edges, and first and second ends; said plates being pivotally joined at said first ends such that said front edges of said plates may be moved relative to each other.",
    "9. The apparatus of claim 8 wherein said moving means includes a bell-crank at said first end and at said back edge of each of said plates.",
    "10. The apparatus of claim 9 wherein said moving means further includes an extendable arm having a first shaft with a threaded end and a second shaft rotatably attached to said first shaft with a mating thread, said first shaft being pivotally attached at one end thereof to said bell-crank, and said second shaft rotatably attached to a means for rotating said extendable arm to adjust the length thereof.",
    "11. The apparatus of claim 10 wherein said rotating means includes a third shaft extending through a wall of the coating chamber; a vacuum seal for rotatably sealing said third shaft to the wall of the coating chamber; and means for rotatably attaching said third shaft to said second shaft.",
    "12. The apparatus of claim 7 wherein said plates are movably supported at said second ends.",
    "13. The apparatus of claim 7 wherein said mask further includes a fixed plate to which said two movable plates are attached.",
    "14. The apparatus of claim 7, wherein said mask includes 4 movable plates.",
    "15. Apparatus for depositing a coating on a substrate by sputtering, comprising: an in-line coating machine including at least one vacuum coating chamber, at least one sputtering cathode mounted in said chamber, and means for transporting the substrate past said sputtering cathode for receiving sputtered material; at least one mask including at least two plates mounted at a position between said cathode and said substrate, each of said plates having front and back edges, and first and second ends, and said plates being pivotally joined at said first ends so that said front edges of said plates may be moved relative to each other; means for mounting said plates in said chamber; and means for pivoting said plates relative to each other.",
    "16. The apparatus of claim 15 wherein said mounting means includes a center pivot bracket supporting said plates at said first ends, and two end supports movably supporting said plates at said second ends.",
    "17. The apparatus of claim 16 wherein said pivoting means includes a bell-crank at said first end and at said back edge of each of said plates.",
    "18. The apparatus of claim 17 wherein said pivoting means further includes an extendable arm pivotally attached at one end thereof to said bell-crank and at a second end thereof to a means for rotating said extendable arm to adjust the length thereof.",
    "19. The apparatus of claim 18 wherein said rotary means includes a shaft extending through a wall of a coating chamber; a vacuum seal for rotatably sealing said shaft to the wall of the coating chamber; and means for attaching said shaft to said extendable arm to couple rotary motion thereto.",
    "20. The apparatus of claim 19 wherein said attaching means includes universal joints."
  ],
  "description_excerpt": "The present invention relates generally to apparatus for sputter deposition of optical coatings, and more particularly to continuous in-line sputtering apparatus for controlling the uniformity of the deposited layers.\n\nReactive sputtering is the process most often used for large area commercial coating applications. Typical applications are thermal control coatings for architectural and automobile glazings. In this process, the articles to be coated are passed through a series of in-line vacuum chambers isolated from one another by vacuum locks. Such an apparatus is referred to as an in-line system or a glass coater. Inside the vacuum chambers, a gas discharge, the sputtering discharge, is maintained. The sputtering discharge pressure is held between about 1 to 5 millitorr, by constantly admitting a mixture of an inert gas, such as argon, with a small proportion of a reactive gas, for example oxygen, for the formation of oxides. Each chamber contains one or more cathodes held at a negative potential in the range from about -200 to -1000 volts. The cathodes may be in the form of elongated rectangles, the length of which spans the width of the chambers. The cathodes are typically 0.10 to 0.30 meters wide and a meter or greater in length. The cathodes are surfaced with a metal with which the reactive gas will form the appropriate compound. This metal surface is frequently referred to as the sputtering target. The cathodes include a magnet array which concentrates the sputtering activity in a narrow region on the target called the sputtering zone. This type of cathode is known as a magnetron cathode.",
  "cpc": [
    "H01J 37/32623",
    "C23C 14/044",
    "H01J 37/34"
  ],
  "ipc": [
    "C23C 14/04",
    "H01J 37/34"
  ],
  "assignees": [
    "Viratec Thin Films Inc"
  ],
  "inventors": [
    "Erik J. Bjornard",
    "Michael J. Valiska",
    "Clifford L. Taylor"
  ],
  "filing_date": "1990-10-12",
  "publication_date": "1992-10-20",
  "grant_date": "1992-10-20",
  "priority_date": "1990-10-12",
  "application_number": "US-59685390-A",
  "family_id": "24388992",
  "cited_by_count": 23,
  "citations": [
    "US3661759A",
    "US4278528A",
    "US4294678A",
    "US4315960A",
    "US4562093A",
    "US4814056A"
  ]
}

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