MLchartDataset catalogue

HSF

Term · Computing and IT · MLC-T-CMP-000541

A heat sink and fan assembly, a cooling solution for electronic components, particularly central processing units (CPUs). It combines a heat sink to draw heat away from the component and a fan to actively move air across the heat sink fins. This combination efficiently dissipates heat to maintain optimal operating temperatures.

Table 1. Record
IdentifierMLC-T-CMP-000541
FieldComputing and IT
SubjectHardware
Record as JSON 
{
  "id": "MLC-T-CMP-000541",
  "term": "HSF",
  "field": "Computing and IT",
  "definition": "A heat sink and fan assembly, a cooling solution for electronic components, particularly central processing units (CPUs). It combines a heat sink to draw heat away from the component and a fan to actively move air across the heat sink fins. This combination efficiently dissipates heat to maintain optimal operating temperatures.",
  "subject": "Hardware",
  "url": "https://mlchart.com/terminology/computing/hsf/"
}

Record 596 of 1,553 in Computing and IT terminology (MLC-0101). Request the full dataset.