3D IC

{
  "id": "MLC-T-IND-000010",
  "term": "3D IC",
  "field": "Industrial and trades",
  "definition": "An integrated circuit where multiple active electronic components are stacked vertically and interconnected, rather than being laid out side-by-side on a single plane. This architecture allows for shorter interconnects, reduced footprint, and improved performance compared to traditional two-dimensional designs. Through-silicon vias (TSVs) are a common method for vertical interconnection in 3D ICs.",
  "subject": "Industrial electronics",
  "references": [
    "3D IC封装技术中硅通孔研究进展综述 (jeit.ac.cn)"
  ],
  "translations": {
    "de": "3D IC",
    "es": "3D IC",
    "fr": "3D IC"
  },
  "url": "https://mlchart.com/terminology/industrial/3d-ic/"
}