MLchartDataset catalogue

3D IC

Term · Semiconductors · MLC-T-SEM-000011

A microchip constructed by vertically stacking multiple active integrated circuit layers or dies and interconnecting them. This architecture allows for shorter electrical paths, higher bandwidth, and reduced power consumption compared to traditional 2D designs. Through-silicon vias (TSVs) are commonly used for vertical connections between layers.

Table 1. Record
IdentifierMLC-T-SEM-000011
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000011",
  "term": "3D IC",
  "field": "Semiconductors",
  "definition": "A microchip constructed by vertically stacking multiple active integrated circuit layers or dies and interconnecting them. This architecture allows for shorter electrical paths, higher bandwidth, and reduced power consumption compared to traditional 2D designs. Through-silicon vias (TSVs) are commonly used for vertical connections between layers.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/3d-ic/"
}

Record 3 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.