MLchartDataset catalogue

Interposer

Term · Semiconductors · MLC-T-SEM-000179

An intermediate substrate used in advanced semiconductor packaging to provide electrical connections and mechanical support between a semiconductor die and a package substrate or printed circuit board. It typically features fine-pitch wiring and through-silicon vias (TSVs) or redistribution layers. Silicon interposers are common in 2.5D packaging to integrate multiple chips side-by-side.

Table 1. Record
IdentifierMLC-T-SEM-000179
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000179",
  "term": "Interposer",
  "field": "Semiconductors",
  "definition": "An intermediate substrate used in advanced semiconductor packaging to provide electrical connections and mechanical support between a semiconductor die and a package substrate or printed circuit board. It typically features fine-pitch wiring and through-silicon vias (TSVs) or redistribution layers. Silicon interposers are common in 2.5D packaging to integrate multiple chips side-by-side.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/interposer/"
}

Record 182 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.