MLchartDataset catalogue

Lead frame

Term · Semiconductors · MLC-T-SEM-000194

A thin metal structure that provides mechanical support and electrical connections for a semiconductor die within a plastic or ceramic package. The die is attached to a central pad, and bond wires connect the die's bond pads to the inner leads of the frame. The outer leads are then formed and trimmed to connect to a printed circuit board.

Table 1. Record
IdentifierMLC-T-SEM-000194
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000194",
  "term": "Lead frame",
  "field": "Semiconductors",
  "definition": "A thin metal structure that provides mechanical support and electrical connections for a semiconductor die within a plastic or ceramic package. The die is attached to a central pad, and bond wires connect the die's bond pads to the inner leads of the frame. The outer leads are then formed and trimmed to connect to a printed circuit board.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/lead-frame/"
}

Record 198 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.