MLchartDataset catalogue

Ball grid array

Term · Semiconductors · MLC-T-SEM-000036

A surface-mount package type for integrated circuits that uses a grid of solder balls on its underside for electrical connections, known as a Ball Grid Array (BGA). This design allows for a high density of interconnects without the fine-pitch leads of other package types. The solder balls are melted during reflow soldering to permanently attach the package to a printed circuit board.

Table 1. Record
IdentifierMLC-T-SEM-000036
FieldSemiconductors
SubjectPackaging & ATMP
AbbreviationBGA
Record as JSON 
{
  "id": "MLC-T-SEM-000036",
  "term": "Ball grid array",
  "field": "Semiconductors",
  "definition": "A surface-mount package type for integrated circuits that uses a grid of solder balls on its underside for electrical connections, known as a Ball Grid Array (BGA). This design allows for a high density of interconnects without the fine-pitch leads of other package types. The solder balls are melted during reflow soldering to permanently attach the package to a printed circuit board.",
  "abbreviation": "BGA",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/ball-grid-array/"
}

Record 28 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.