MLchartDataset catalogue

Chip-scale package

Term · Semiconductors · MLC-T-SEM-000058

A semiconductor package whose area is no more than 1.2 times the area of the silicon die it contains. This compact form factor minimizes the package footprint, making it suitable for space-constrained applications like mobile devices. CSPs often use ball grid array connections and are designed for direct surface mounting onto a printed circuit board.

Table 1. Record
IdentifierMLC-T-SEM-000058
FieldSemiconductors
SubjectPackaging & ATMP
AbbreviationCSP
Record as JSON 
{
  "id": "MLC-T-SEM-000058",
  "term": "Chip-scale package",
  "field": "Semiconductors",
  "definition": "A semiconductor package whose area is no more than 1.2 times the area of the silicon die it contains. This compact form factor minimizes the package footprint, making it suitable for space-constrained applications like mobile devices. CSPs often use ball grid array connections and are designed for direct surface mounting onto a printed circuit board.",
  "abbreviation": "CSP",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/chip-scale-package/"
}

Record 52 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.