MLchartDataset catalogue

System in package

Term · Semiconductors · MLC-T-SEM-000325

An integrated circuit package containing multiple functional electronic components, such as processors, memory, and passive devices, assembled as a single unit. A System in Package, or SiP, integrates these disparate components, which may be fabricated with different process technologies, onto a common substrate. Unlike a System on Chip (SoC) which integrates all functions onto a single silicon die, a SiP combines separate dies and components within one package.

Table 1. Record
IdentifierMLC-T-SEM-000325
FieldSemiconductors
SubjectPackaging & ATMP
AbbreviationSiP
Record as JSON 
{
  "id": "MLC-T-SEM-000325",
  "term": "System in package",
  "field": "Semiconductors",
  "definition": "An integrated circuit package containing multiple functional electronic components, such as processors, memory, and passive devices, assembled as a single unit. A System in Package, or SiP, integrates these disparate components, which may be fabricated with different process technologies, onto a common substrate. Unlike a System on Chip (SoC) which integrates all functions onto a single silicon die, a SiP combines separate dies and components within one package.",
  "abbreviation": "SiP",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/system-in-package/"
}

Record 341 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.