MLchartDataset catalogue

2.5D packaging

Term · Semiconductors · MLC-T-SEM-000009

An advanced packaging technology that integrates multiple semiconductor dies side-by-side on a silicon interposer, which then connects to a package substrate. This approach allows for high-density integration and improved communication between chips without the complexity of full 3D stacking. It is often used for high-performance computing and memory applications.

Table 1. Record
IdentifierMLC-T-SEM-000009
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000009",
  "term": "2.5D packaging",
  "field": "Semiconductors",
  "definition": "An advanced packaging technology that integrates multiple semiconductor dies side-by-side on a silicon interposer, which then connects to a package substrate. This approach allows for high-density integration and improved communication between chips without the complexity of full 3D stacking. It is often used for high-performance computing and memory applications.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/2-5d-packaging/"
}

Record 1 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.