Semiconductors terminology · MLC-0108

Semiconductors terms: 0-9 (5)

• 2.5D packagingAn advanced packaging technology that integrates multiple semiconductor dies side-by-side on a silicon...
• 300 mmA standard diameter for silicon wafers used in advanced semiconductor manufacturing. Wafers of this size...
• 3D ICA microchip constructed by vertically stacking multiple active integrated circuit layers or dies and...
• 3D NANDA type of non-volatile flash memory architecture where memory cells are stacked vertically in multiple...
• 8DA structured problem-solving methodology, often used in semiconductor manufacturing, to identify, correct...

5 of 390 terms in Semiconductors terminology (MLC-0108). Request the full dataset.