Semiconductors terminology · MLC-0108

Semiconductors terms: B (14)

• Back end of lineThe portion of semiconductor manufacturing that involves creating the interconnects between the individual...
• BackgrindingA mechanical process that reduces the thickness of a semiconductor wafer after the front-end fabrication...
• Ball grid arrayA surface-mount package type for integrated circuits that uses a grid of solder balls on its underside for...
• BandgapThe minimum energy required to excite an electron from a bound state in the valence band to a free state in...
• Barrier layerA thin film deposited in semiconductor devices to prevent the diffusion of atoms between adjacent material...
• Bathtub curveA graphical representation of a product's failure rate over its operational lifetime, which has three...
• BinA category or group into which semiconductor devices are sorted based on their electrical performance...
• BottleneckA point in a manufacturing process where the flow of work-in-progress is limited, causing queues and reducing...
• BrightfieldAn optical inspection technique where a semiconductor wafer is illuminated from above, and defects are...
• Built-in self-testA design technique where parts of a circuit are dedicated to testing the circuit itself, reducing reliance on...
• Bulk gasA gas supplied in large quantities to a semiconductor fabrication plant from an external source, as opposed...
• BumpA small mound of conductive material, such as solder or copper, formed on the input/output pads of a...
• Bunny suitA full-body garment worn by personnel in semiconductor cleanrooms to prevent the shedding of particles and...
• Burn-inA stress testing process applied to semiconductor devices, typically integrated circuits, to accelerate...

14 of 390 terms in Semiconductors terminology (MLC-0108). Request the full dataset.