MLchartDataset catalogue

Bump

Term · Semiconductors · MLC-T-SEM-000045

A small mound of conductive material, such as solder or copper, formed on the input/output pads of a semiconductor die. These bumps provide the electrical and mechanical connection between the die and a substrate or another die in flip-chip and other advanced packaging technologies. The process of adding these connections is called bumping, and the bumps are arranged in a grid pattern across the die surface.

Table 1. Record
IdentifierMLC-T-SEM-000045
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000045",
  "term": "Bump",
  "field": "Semiconductors",
  "definition": "A small mound of conductive material, such as solder or copper, formed on the input/output pads of a semiconductor die. These bumps provide the electrical and mechanical connection between the die and a substrate or another die in flip-chip and other advanced packaging technologies. The process of adding these connections is called bumping, and the bumps are arranged in a grid pattern across the die surface.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/bump/"
}

Record 37 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.