Outsourced semiconductor assembly and test

{
  "id": "MLC-T-SEM-000237",
  "term": "Outsourced semiconductor assembly and test",
  "field": "Semiconductors",
  "definition": "A business model where semiconductor companies contract third-party providers to perform the assembly, packaging, and testing of integrated circuits. These specialized firms receive fabricated wafers, dice them, package the individual chips, and then conduct electrical and reliability tests before shipping the finished products. OSAT companies offer a range of packaging technologies, from wire bonding to advanced flip-chip and wafer-level packaging.",
  "abbreviation": "OSAT",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/outsourced-semiconductor-assembly-and-test/"
}