MLchartDataset catalogue

Wire bonding

Term · Semiconductors · MLC-T-SEM-000361

A method of making electrical interconnections between a semiconductor chip and its package or between two chips using fine metal wires. This process involves forming a bond between the wire and the bond pads on the chip and substrate, typically using gold, aluminum, or copper wires. Common techniques include thermosonic, thermocompression, and ultrasonic bonding.

Table 1. Record
IdentifierMLC-T-SEM-000361
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000361",
  "term": "Wire bonding",
  "field": "Semiconductors",
  "definition": "A method of making electrical interconnections between a semiconductor chip and its package or between two chips using fine metal wires. This process involves forming a bond between the wire and the bond pads on the chip and substrate, typically using gold, aluminum, or copper wires. Common techniques include thermosonic, thermocompression, and ultrasonic bonding.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/wire-bonding/"
}

Record 381 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.