MLchartDataset catalogue

Temperature cycling

Term · Semiconductors · MLC-T-SEM-000329

A reliability test method that subjects semiconductor devices to alternating high and low temperatures to simulate thermal expansion and contraction stresses experienced during operation. This process accelerates potential failure mechanisms such as solder joint fatigue, delamination, and wire bond breaks. The number of cycles and temperature range are defined by industry standards like JEDEC.

Table 1. Record
IdentifierMLC-T-SEM-000329
FieldSemiconductors
SubjectTest & Reliability
Record as JSON 
{
  "id": "MLC-T-SEM-000329",
  "term": "Temperature cycling",
  "field": "Semiconductors",
  "definition": "A reliability test method that subjects semiconductor devices to alternating high and low temperatures to simulate thermal expansion and contraction stresses experienced during operation. This process accelerates potential failure mechanisms such as solder joint fatigue, delamination, and wire bond breaks. The number of cycles and temperature range are defined by industry standards like JEDEC.",
  "subject": "Test & Reliability",
  "url": "https://mlchart.com/terminology/semiconductors/temperature-cycling/"
}

Record 345 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.