MLchartDataset catalogue

Tape-out

Term · Semiconductors · MLC-T-SEM-000328

The final stage in the integrated circuit design process where the completed layout data, typically in GDSII format, is sent to a semiconductor foundry for manufacturing. This marks the end of the design phase and the beginning of the fabrication process. A successful tape-out signifies that the design is ready for physical production.

Table 1. Record
IdentifierMLC-T-SEM-000328
FieldSemiconductors
SubjectDesign, EDA & Devices
Record as JSON 
{
  "id": "MLC-T-SEM-000328",
  "term": "Tape-out",
  "field": "Semiconductors",
  "definition": "The final stage in the integrated circuit design process where the completed layout data, typically in GDSII format, is sent to a semiconductor foundry for manufacturing. This marks the end of the design phase and the beginning of the fabrication process. A successful tape-out signifies that the design is ready for physical production.",
  "subject": "Design, EDA & Devices",
  "url": "https://mlchart.com/terminology/semiconductors/tape-out/"
}

Record 344 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.