MLchartDataset catalogue

Fan-out

Term · Semiconductors · MLC-T-SEM-000130

A wafer-level packaging technology where the individual dies are redistributed on a carrier wafer with a larger area than the original die. This redistribution allows for a greater number of I/O connections to be fanned out over a larger area, improving electrical performance and thermal management. FOWLP (Fan-Out Wafer Level Packaging) eliminates the need for an interposer in some applications.

Table 1. Record
IdentifierMLC-T-SEM-000130
FieldSemiconductors
SubjectPackaging & ATMP
AbbreviationFOWLP
Record as JSON 
{
  "id": "MLC-T-SEM-000130",
  "term": "Fan-out",
  "field": "Semiconductors",
  "definition": "A wafer-level packaging technology where the individual dies are redistributed on a carrier wafer with a larger area than the original die. This redistribution allows for a greater number of I/O connections to be fanned out over a larger area, improving electrical performance and thermal management. FOWLP (Fan-Out Wafer Level Packaging) eliminates the need for an interposer in some applications.",
  "abbreviation": "FOWLP",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/fan-out/"
}

Record 129 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.