MLchartDataset catalogue

Flip chip

Term · Semiconductors · MLC-T-SEM-000136

A method of interconnecting a semiconductor die to a package substrate or another die by inverting the die so its active face with solder bumps directly contacts corresponding pads on the substrate. This technique eliminates the need for wire bonding, resulting in shorter electrical paths, improved performance, and a smaller form factor. It is widely used for high-performance processors and memory.

Table 1. Record
IdentifierMLC-T-SEM-000136
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000136",
  "term": "Flip chip",
  "field": "Semiconductors",
  "definition": "A method of interconnecting a semiconductor die to a package substrate or another die by inverting the die so its active face with solder bumps directly contacts corresponding pads on the substrate. This technique eliminates the need for wire bonding, resulting in shorter electrical paths, improved performance, and a smaller form factor. It is widely used for high-performance processors and memory.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/flip-chip/"
}

Record 135 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.