MLchartDataset catalogue

Underfill

Term · Semiconductors · MLC-T-SEM-000343

A polymeric material dispensed into the gap between a flip-chip or chip-scale package and its substrate. It mechanically couples the chip to the substrate, distributing stress caused by differences in the coefficient of thermal expansion. This material typically cures at elevated temperatures, forming a strong bond.

Table 1. Record
IdentifierMLC-T-SEM-000343
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000343",
  "term": "Underfill",
  "field": "Semiconductors",
  "definition": "A polymeric material dispensed into the gap between a flip-chip or chip-scale package and its substrate. It mechanically couples the chip to the substrate, distributing stress caused by differences in the coefficient of thermal expansion. This material typically cures at elevated temperatures, forming a strong bond.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/underfill/"
}

Record 362 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.