Die shear

{
  "id": "MLC-T-SEM-000095",
  "term": "Die shear",
  "field": "Semiconductors",
  "definition": "A destructive test method used to assess the mechanical strength of the bond between a semiconductor die and its substrate or package. A shear tool applies a lateral force to the die until it detaches or fractures, measuring the force required for failure. This test provides data on the adhesion quality of the die attach material and the integrity of the bond interface, with typical shear strengths measured in kilograms-force or Newtons.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/die-shear/"
}