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Wire pull

Term · Semiconductors · MLC-T-SEM-000362

A destructive mechanical test used to determine the strength of the bond between a wire and its attachment points on a semiconductor die and package substrate. A hook is placed under the wire, which is then pulled upward with a measured force until either the wire breaks or one of the bonds fails. The test results are measured in units of grams-force or Newtons and are compared against standards like MIL-STD-883.

Table 1. Record
IdentifierMLC-T-SEM-000362
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000362",
  "term": "Wire pull",
  "field": "Semiconductors",
  "definition": "A destructive mechanical test used to determine the strength of the bond between a wire and its attachment points on a semiconductor die and package substrate. A hook is placed under the wire, which is then pulled upward with a measured force until either the wire breaks or one of the bonds fails. The test results are measured in units of grams-force or Newtons and are compared against standards like MIL-STD-883.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/wire-pull/"
}

Record 382 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.